Enhanced durability multimedia card

• US 20080169541A1
• Filed: 10/14/2005
• Published: 07/17/2008
• Est. Priority Date: 09/19/2001
• Status: Abandoned Application

• Current Assignee: Chung-Hsing Tzu, Jeffrey Alan Miks, Robert Francis Darveaux
• Original Assignee: Chung-Hsing Tzu, Jeffrey Alan Miks, Robert Francis Darveaux
• Inventors: Tzu, Chung-Hsing, Darveaux, Robert Francis, Miks, Jeffrey Alan
• Application Number:
  US11/250,816
• Publication Number:
  US 20080169541A1
• Time in Patent Office: Days
• US Class Current: 257/679
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A memory card comprising a leadframe having a plurality of contacts. Electrically connected to the leadframe is at least one semiconductor die. A body at least partially encapsulates the leadframe and includes opposed top and bottom surfaces, an opposed pair of longitudinal sides, and an opposed pair of lateral sides. The contacts of the leadframe are exposed in the bottom surface of the body and extend to one of the lateral sides thereof.

Claims

1-8. -8. (canceled)

9. A memory card comprising:

a leadframe having a plurality of contacts;

at least one semiconductor die electrically connected to the leadframe; and

a body at least partially encapsulating the leadframe and including;

opposed top and bottom surfaces;

an opposed pair of longitudinal sides; and

an opposed pair of lateral sides;

the contacts of the leadframe being exposed in the bottom surface of the body and extending to a notch formed in the body and extending along one of the lateral sides thereof.

10. The memory card of claim 9 wherein:

the bottom surface of the body is generally planar; and

each of the contacts defines a generally planar bottom surface which is substantially flush with the bottom surface of the body.

11. The memory card of claim 9 wherein the body further includes a sloped side which extends between one of the lateral sides and one of the longitudinal sides thereof, the notch extending along the lateral side which extends to the sloped side and along at least a portion of the sloped side.

12. The memory card of claim 9 wherein the leadframe includes seven contacts.

13. The memory card of claim 9 wherein the leadframe further includes a pair of dummy pads which are exposed in the bottom surface of the body and extend to the notch.

14. The memory card of claim 13 wherein the leadframe includes seven contacts.

15. The leadframe of claim 13 wherein:

the body further includes a sloped side which extends between one of the longitudinal sides and one of the lateral sides thereof, the notch extending along at least a portion of the sloped side and along the lateral side which extends to the sloped side; and

one of the dummy pads extends to a portion of the notch extending along the sloped side, with the remaining one of the dummy pads extending to a portion of the notch which extends along one of the lateral sides.

16. The memory card of claim 9 wherein the notch is partially defined by a shoulder which is perpendicularly recessed relative to the bottom surface of the body.

17. A method of fabricating a memory card, comprising the steps of:

a) providing a leadframe having a plurality of contacts;

b) electrically connecting at least one semiconductor die to the leadframe;

c) partially encapsulating the leadframe and the semiconductor die with a body which includes opposed top and bottom surfaces, an opposed pair of longitudinal sides, and an opposed pair of lateral sides; and

d) ablating a portion of the body in a manner facilitating the formation of a notch which extends between the contacts and one of the lateral sides of the body.

18. The method of claim 17 wherein step (d) is accomplished through the use of a laser.

19. The method of claim 17 wherein:

step (c) comprises forming the body to include a sloped side which extends between one of the lateral sides and one of the longitudinal sides thereof; and

step (d) comprises ablating the body such that the notch extends along at least a portion of the sloped side and along the lateral side which extends to the sloped side.

20. The method of claim 19 wherein:

step (a) comprises providing a leadframe which further includes a pair of dummy pads;

step (c) comprises forming the body such that the dummy pads are exposed in the bottom surface thereof; and

step (d) comprises ablating the body such that each of the dummy pads and each of the contacts extends to the notch formed in the body.

21. A memory card for insertion into a host socket having connector pins, the memory card comprising:

a leadframe having a plurality of contacts;

at least one semiconductor die electrically connected to the leadframe; and

a body at least partially encapsulating the leadframe and including;

opposed top and bottom surfaces;

a first pair of opposed sides; and

a second pair of opposed sides, one of the opposed sides of the second pair defining a leading edge of the body;

the contacts of the leadframe being exposed in the bottom surface of the body and disposed in spaced relation to the leading edge thereof, the body being formed such that the connector pins of the host socket do not travel over the body prior to engaging the contacts when the memory card is advanced into the host socket.

22. The memory card of claim 21 wherein:

the bottom surface of the body is generally planar; and

each of the contacts defines a generally planar bottom surface which is substantially flush with the bottom surface of the body.

23. The memory card of claim 21 wherein the body further includes a sloped side which extends between one of the sides of the first pair and one of the sides of the second pair.

24. The memory card of claim 21 wherein the leadframe includes seven contacts.

25. The memory card of claim 21 wherein:

the leadframe further includes a pair of dummy pads which are exposed in the bottom surface of the body and disposed in spaced relation to the leading edge thereof; and

the body is formed such that the connector pins of the host socket do not travel over the body prior to engaging the dummy pads when the memory card is advanced into the host socket.

26. The memory card of claim 25 wherein the leadframe includes seven contacts.

27. The memory card of claim 25 wherein the body further includes a sloped side which extends between one of the sides of the first pair and one of the sides of the second pair.

28. The memory card of claim 21 wherein the contacts extend to a notch which is formed in the body.