Combination assembly of led and heat sink

• US 20080170371A1
• Filed: 04/26/2007
• Published: 07/17/2008
• Est. Priority Date: 01/12/2007
• Status: Abandoned Application

• Current Assignee: Tai-Sol Electronics Co., Ltd.
• Original Assignee: Tai-Sol Electronics Co., Ltd.
• Inventors: Lai, Yaw-Huey
• Application Number:
  US11/790,525
• Publication Number:
  US 20080170371A1
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: F21V 29/503 of light sources cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H01L33/64
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

A combination assembly of LED and heat sink includes a heat sink having a substrate and a plurality of fins, a circuit board provided on the substrate and at least one LED unit provided on the heat sink and electrically connected to the circuit board. The heat of the LED unit may be transmitted to the heat sink directly for heat transmission. The present invention has a greater heat transmission efficiency.

Claims

1. A combination assembly of LED and heat sink, comprising:

a heat sink including a substrate and a plurality of fins;

a circuit board provided on the substrate; and

at least one LED unit provided on the heat sink and electrically connected to the circuit board.

2. The combination assembly of LED and heat sink as defined in claim 1, wherein there are two or more LED units, each of which includes a LED chip provided on the substrate, at least one wire having opposite ends connected to the LED chip and the circuit board respectively and a package device encapsulating the LED chip and the wire.

3. The combination assembly of LED and heat sink as defined in claim 2, wherein the LED chip has an anode connected to the wire and a cathode connected to the substrate.

4. The combination assembly of LED and heat sink as defined in claim 2, wherein the LED chip has an anode and a cathode at a top thereof and an insulating layer on a bottom thereof, wherein the insulating layer is mounted on the substrate, and the anode and the cathode are electrically connected to the circuit board through two of the wires.

5. The combination assembly of LED and heat sink as defined in claim 1, wherein there are two or more LED units, each of which includes a heat transmission base, a LED chip provided on the heat transmission base, two wires having opposite ends connected to an anode and a cathode of the LED chip and the circuit board respectively and a package device encapsulating the LED chip and the wire.

6. The combination assembly of LED and heat sink as defined in claim 2, wherein the package device is an encapsulant.

7. The combination assembly of LED and heat sink as defined in claim 5, wherein the package device is an encapsulant.

8. The combination assembly of LED and heat sink as defined in claim 1, wherein the package device is a lid.