CIRCUIT STRUCTURE HAVING INDEPENDENT GROUND PLANE LAYOUTS IMPLEMENTED IN CIRCUIT BOARD

• US 20080170378A1
• Filed: 06/28/2007
• Published: 07/17/2008
• Est. Priority Date: 01/17/2007
• Status: Abandoned Application

• Current Assignee: MediaTek, Inc.
• Original Assignee: MediaTek, Inc.
• Inventors: Ou-Yang, Cheng-Yi
• Application Number:
  US11/769,711
• Publication Number:
  US 20080170378A1
• Time in Patent Office: Days
• US Class Current: 361/799
• CPC Class Codes: H05K 1/0201 Thermal arrangements, e.g. for cooling, heating or preventing overheating
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/062 Means for thermal insulation, e.g. for protection of parts
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
• CPC Class Codes: H05K 2201/09663 Divided layout, i.e. conductors divided in two or more parts
• CPC Class Codes: H05K 2201/09972 Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
• CPC Class Codes: H05K 2203/304 Protecting a component during manufacturing

Abstract

A circuit structure includes a circuit board, a first circuit component mounted on the circuit board, and a second circuit component mounted on the circuit board. The first circuit board has a first ground plane layout including at least one ground plane, and a second ground plane layout including at least one ground plane, where the first ground plane layout is not electrically connected to the second ground plane layout within the circuit board. The first circuit component is electrically connected to the first ground plane layout, and the second circuit component is electrically connected to the second ground plane layout.

Claims

1. A circuit structure, comprising:

a first circuit board, comprising;

a first ground plane layout, comprising at least one ground plane; and

a second ground plane layout, comprising at least one ground plane, wherein the first ground plane layout is not electrically connected to the second ground plane layout within the first circuit board.

2. The circuit structure of claim 1, wherein the first ground plane layout and the second ground plane layout have no direct contact within the first circuit board.

3. The circuit structure of claim 1, further comprising:

a first circuit component, mounted on the first circuit board and electrically connected to the first ground plane layout; and

a second circuit component, mounted on the first circuit board and electrically connected to the second ground plane layout.

4. The circuit structure of claim 3, wherein the first circuit component is an oscillator.

5. The circuit structure of claim 4, wherein the second circuit component is a signal processor of a global navigation satellite system (GNSS), and the oscillator is for providing an oscillating signal associated with operations of the signal processor.

6. The circuit structure of claim 3, wherein the first ground plane layout comprises a ground plane with a hollow region covered by the first circuit component in a thickness direction of the first circuit board.

7. The circuit structure of claim 3, wherein the first circuit board has at least one layer on which no ground plane overlapped with the first ground plane layout in a thickness direction of the first circuit board is disposed.

8. The circuit structure of claim 7, wherein the first circuit board has no ground plane overlapped with the first ground plane layout in the thickness direction of the first circuit board.

9. The circuit structure of claim 3, wherein within the first circuit board, the first ground plane layout is electrically connected to the first circuit component only.

10. The circuit structure of claim 1, further comprising:

a second circuit board, on which the first circuit board is mounted, the second circuit board comprising;

a third ground plane layout, electrically connected to the first ground plane layout, comprising at least one ground plane; and

a fourth ground plane layout, electrically connected to the second ground plane layout, comprising at least one ground layer, wherein the fourth ground plane layout is not electrically connected to the third ground plane layout within the second circuit board.

11. The circuit structure of claim 10, wherein the first ground plane layout is not overlapped with the fourth ground plane layout in a thickness direction of the first circuit board, and the second ground plane layout is not overlapped with third ground plane layout in the thickness direction of the first circuit board.

12. The circuit structure of claim 10, further comprising:

a first circuit component, mounted on the first circuit board and electrically connected to the first ground plane layout; and

a second circuit component, mounted on the first circuit board and electrically connected to the second ground plane layout.

13. The circuit structure of claim 12, wherein the first circuit component is an oscillator.

14. The circuit structure of claim 13, wherein the second circuit component is a signal processor of a global navigation satellite system (GNSS), and the oscillator is for providing an oscillating signal associated with operations of the signal processor.

15. The circuit structure of claim 10, further comprising:

at least one passive component, mounted on the second circuit board, for electrically connecting the third ground plane layout and the fourth ground plane layout.

16. The circuit structure of claim 15, wherein the third ground plane layout is electrically connected to the fourth ground plane layout through passive component(s) mounted on the second circuit board only.

17. The circuit structure of claim 15, wherein the passive component is a resistor or a low AC impedance inductor.

18. A circuit structure, comprising:

a circuit board, comprising;

a first ground plane layout, comprising at least one ground layer; and

a second ground plane layout, comprising at least one ground layer, wherein the first ground plane layout is not electrically connected to the second ground plane within the circuit board; and

at least a passive component, mounted on the circuit board, for electrically connecting the first ground plane layout to the second ground plane layout.

19. The circuit structure of claim 18, wherein the first ground plane layout is electrically connected to the second ground plane layout through passive component(s) mounted on the circuit board only

20. The circuit structure of claim 18, wherein the passive component is a resistor or a low AC impedance inductor.

21. The circuit structure of claim 18, further comprising:

a first circuit component, mounted on the circuit board and electrically connected to the first ground plane layout; and

a second circuit component, mounted on the circuit board and electrically connected to the second ground plane layout.

22. The circuit structure of claim 21, wherein the first circuit component is an oscillator.

23. The circuit structure of claim 22, wherein the second circuit component is a signal processor of a global navigation satellite system (GNSS), and the oscillator is for providing an oscillating signal associated with operations of the signal processor.

24. The circuit structure of claim 23, wherein the signal processor and the oscillator are mounted at different sides of the circuit board.

25. The circuit structure of claim 21, wherein the first ground plane layout has an inner hollow region covered by the first circuit component in a thickness direction of the circuit board.

26. The circuit structure of claim 21, wherein the circuit board has at least one layer on which no ground plane overlapped with the first ground plane layout in a thickness direction of the circuit board is disposed.

27. The circuit structure of claim 26, wherein the circuit board has no ground plane overlapped with the first ground plane layout in the thickness direction of the circuit board is disposed.