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High Performance LED Package

  • US 20080173883A1
  • Filed: 01/19/2007
  • Published: 07/24/2008
  • Est. Priority Date: 01/19/2007
  • Status: Active Grant
First Claim
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1. A light emitting diode lamp comprising:

  • a resin package with an aspect ratio greater than 1;

    1 that defines a recess in the shape of a three dimensional solid;

    said recess comprising a floor with an aspect ratio greater than 1;

    1, side walls along the respective longer sides of said floor, and end walls along the respective shorter sides of said floor;

    said package defining a first plane bisecting said package along its long axis and a second plane bisecting said package along its narrow axis.said recess having a geometry selected from the group consisting of (i) said side walls defining an angle therebetween and along said second plane greater than 3°

    , (ii) said end walls defining an angle therebetween and along said first plane greater than 40°

    , and (iii) combinations thereof, anda light emitting diode chip on said floor of said package.

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