Light-emitting diode chip package body and packaging method thereof

• US 20080173888A1
• Filed: 01/09/2008
• Published: 07/24/2008
• Est. Priority Date: 01/16/2004
• Status: Active Grant

• Current Assignee: Yu-Nung Shen
• Original Assignee: Yu-Nung Shen
• Inventors: Shen, Yu-Nung
• Granted Patent: US 7,989,817 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/1147 using a lift-off mask
• CPC Class Codes: H01L 2224/13016 in side view
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13583 Three-layer coating
• CPC Class Codes: H01L 2224/13624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.

Claims

1. A light-emitting diode chip package body, comprising:

a light-emitting diode chip having a pad-installed surface formed thereon, a plurality of pads installed on the pad-installed surface and a rear surface formed on an opposite side of the pad-installed surface;

a light-reflecting coating disposed on the rear surface of the light-emitting diode chip;

an insulative protective layer formed on the light-reflecting coating;

a surface insulation layer disposed on the rear surface of the light-emitting diode chip, and having a central through hole for exposure of a central portion of the rear surface and a plurality of pad-exposed holes for exposure of the corresponding pads;

a first light-transparent element received in the central through hole of the insulative protective layer; and

a plurality of conductive projecting blocks, each conductive projecting block being disposed on a corresponding pad of the light-emitting diode.

2. The package body as claimed in claim 1, wherein the first light-transparent element has a planar top portion.

3. The package body as claimed in claim 2, further comprising a second light-transparent element disposed on the planar top portion of the first light-transparent element, both the first and the second light-transparent elements being doped with light-polarizing compounds with different wavelengths.

4. The package body as claimed in claim 1, wherein each of the conductive projecting blocks comprises:

a protrusion made of a nonconductive material and disposed on the corresponding pad of the light-emitting diode chip;

a first metal layer formed on the corresponding pad of the light-emitting diode chip for covering a corresponding surface of the pad and the protrusion of the corresponding pad; and

a second metal layer formed on the corresponding first metal layer.

5. The package body as claimed in claim 4, wherein each of the second metal layers is composed of a nickel layer and a gold layer.

6. The package body as claimed in claim 1, further comprising a bonded metal layer formed on the corresponding pad.

7. The package body as claimed in claim 6, wherein each of the conductive projecting blocks comprises:

a protrusion made of a nonconductive material and disposed on a corresponding bonded metal layer;

a first metal layer formed on the corresponding bonded metal layer for covering a corresponding surface of the bonded metal layer and the protrusion of the corresponding bonded metal layer; and

a second metal layer formed on the corresponding first metal layer.

8. The package body as claimed in claim 7, wherein each of the second metal layers is composed of a nickel layer and a gold layer.

9. The package body as claimed in claim 1, wherein the conductive projecting blocks are made of gold.

10. The package body as claimed in claim 1, wherein each of the conductive projecting blocks comprises:

a conductive contact point disposed on the corresponding pad of the light-emitting diode chip; and

a conductive welded point disposed on the corresponding conductive contact point.