INTEGRATED CIRCUIT SYSTEM EMPLOYING STRESS-ENGINEERED SPACERS
First Claim
1. An integrated circuit system comprising:
- providing a substrate including a first region with a first device and a second device and a second region with a resistance device;
configuring the first device, the second device, and the resistance device to include a first spacer and a second spacer;
forming a stress inducing layer over the first region and the second region;
processing at least a portion of the stress inducing layer formed over the first region to alter the stress within the stress inducing layer; and
forming a third spacer adjacent the second spacer of the first device and the second device from the stress inducing layer.
6 Assignments
0 Petitions
Accused Products
Abstract
An integrated circuit system that includes: providing a substrate including a first region with a first device and a second device and a second region with a resistance device; configuring the first device, the second device, and the resistance device to include a first spacer and a second spacer; forming a stress inducing layer over the first region and the second region; processing at least a portion of the stress inducing layer formed over the first region to alter the stress within the stress inducing layer; and forming a third spacer adjacent the second spacer of the first device and the second device from the stress inducing layer.
58 Citations
20 Claims
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1. An integrated circuit system comprising:
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providing a substrate including a first region with a first device and a second device and a second region with a resistance device; configuring the first device, the second device, and the resistance device to include a first spacer and a second spacer; forming a stress inducing layer over the first region and the second region; processing at least a portion of the stress inducing layer formed over the first region to alter the stress within the stress inducing layer; and forming a third spacer adjacent the second spacer of the first device and the second device from the stress inducing layer. - View Dependent Claims (2, 3, 4, 5)
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6. An integrated circuit system comprising:
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providing a substrate including a first region with a first device and a second device and a second region with a resistance device; configuring the first device, the second device, and the resistance device to include a first spacer and a second spacer; forming a stress inducing layer over the first region and the second region; processing at least a portion of the stress inducing layer formed over the second device to alter the stress within the stress inducing layer; and forming a third spacer from the stress inducing layer to create a first stress level in the first device and a second stress level in the second device, the first stress level differing from the second stress level. - View Dependent Claims (7, 8, 9, 10)
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11. An integrated circuit system comprising:
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a substrate including a first region with a first device and a second device and a second region with a resistance device; the first device, the second device, and the resistance device each including a first spacer and a second spacer; and the first device and the second device further including a third spacer that creates a first stress level in the first device and a second stress level in the second device, the first stress level differing from the second stress level. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification