MECHANICALLY ROBUST METAL/LOW-k INTERCONNECTS
First Claim
1. A method for improving the adhesion strength between two different layers comprising:
- treating a surface of a dielectric-containing substrate with at least one of actinic radiation, a plasma, and electron beam radiation to form a treated surface layer within the substrate that is physically and chemically different from said substrate;
forming a low-k dielectric layer having a dielectric constant of less than 4.0 on said treated surface layer.
5 Assignments
0 Petitions
Accused Products
Abstract
A mechanically robust semiconductor structure with improved adhesion strength between a low-k dielectric layer and a dielectric-containing substrate is provided. In particular, the present invention provides a structure that includes a dielectric-containing substrate having an upper region including a treated surface layer which is chemically and physically different from the substrate; and a low-k dielectric material located on a the treated surface layer of the substrate. The treated surface layer and the low-k dielectric material form an interface that has an adhesion strength that is greater than 60% of the cohesive strength of the weaker material on either side of the interface. The treated surface is formed by treating the surface of the substrate with at least one of actinic radiation, a plasma and e-beam radiation prior to forming of the substrate the low-k dielectric material.
-
Citations
20 Claims
-
1. A method for improving the adhesion strength between two different layers comprising:
-
treating a surface of a dielectric-containing substrate with at least one of actinic radiation, a plasma, and electron beam radiation to form a treated surface layer within the substrate that is physically and chemically different from said substrate; forming a low-k dielectric layer having a dielectric constant of less than 4.0 on said treated surface layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A method of forming an interconnect structure comprising:
-
providing an interconnect level having at least one conductive feature embedded within a dielectric material; forming a dielectric capping layer on an upper surface of said interconnect level; and treating the dielectric capping layer with at least one of actinic radiation, a plasma, and electron beam radiation to form a treated surface layer within the dielectric capping layer that is physically and chemically different from said dielectric capping layer. - View Dependent Claims (11, 12, 13)
-
-
14. A semiconductor structure comprising:
-
a dielectric-containing substrate having an upper region including a treated surface layer which is chemically and physically different from said substrate; and a low-k dielectric having a dielectric constant of less than 4.0 located on a said treated surface layer of said substrate, wherein said treated surface layer and said low-k dielectric form an interface that has an adhesion strength that is greater than 60% of the cohesive strength of the weaker material on either side of said interface. - View Dependent Claims (15, 16, 17, 18, 19, 20)
-
Specification