PRE-MOLDED CLIP STRUCTURE
First Claim
Patent Images
1. A method comprising:
- obtaining a first clip and a second clip; and
forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface,wherein the first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and wherein a premolded clip structure is thereafter formed.
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Abstract
A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
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Citations
20 Claims
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1. A method comprising:
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obtaining a first clip and a second clip; and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface, wherein the first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and wherein a premolded clip structure is thereafter formed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A premolded clip structure comprising:
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a first clip comprising a first surface; a second clip comprising a second surface; and a molding material coupled to the first clip and the second clip, wherein the first and second surfaces are exposed through the molding material. - View Dependent Claims (12)
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13. A semiconductor die package comprising:
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a premolded clip structure comprising a first clip comprising a first surface, a second clip comprising a second surface, and a molding material coupled to the first clip and the second clip, wherein the first and second surfaces are exposed through the molding material; and a semiconductor die comprising a first die surface and a second die surface, and a first electrical terminal and a second electrical terminal at the first die surface, wherein the first surface is electrically coupled to the first electrical terminal and the second surface is electrically coupled to the second electrical terminal. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification