TEST SOCKETS HAVING PELTIER ELEMENTS, TEST EQUIPMENT INCLUDING THE SAME AND METHODS OF TESTING SEMICONDUCTOR PACKAGES USING THE SAME

• US 20080174333A1
• Filed: 01/21/2008
• Published: 07/24/2008
• Est. Priority Date: 01/22/2007
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Hong, Jun-Pyo
• Granted Patent: US 7,659,738 B2
• Time in Patent Office: Days
• US Class Current: 324/765
• CPC Class Codes: G01R 1/0458 related to environmental aspects, e.g. temperature
• CPC Class Codes: G01R 31/2863 Contacting devices, e.g. sockets, burn-in boards or mounting fixtures in general G01R1/04
• CPC Class Codes: H10N 10/00 Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects integrated devices or assemblies of multiple devices H10N19/00

Abstract

A test socket includes a socket body in which a semiconductor package is located, a socket head combined with the socket body, a Peltier element in the socket head, and power terminals connected to the Peltier element. A test equipment includes the test socket and a method of testing the semiconductor package uses the test socket.

Claims

1. A test socket comprising:

a socket body in which a semiconductor package is located;

a socket head combined with the socket body;

a Peltier element arranged in the socket head adjacent the semiconductor package; and

power terminals connected to the Peltier element.

2. The test socket as set forth in claim 1, wherein the socket head comprises a plate disposed between the Peltier element in the socket head and the semiconductor package in the socket body, and wherein the plate between the Peltier element and the semiconductor package comprises a thermal conductive material.

3. The test socket as set forth in claim 2, wherein the socket head comprises a plurality of openings.

4. The test socket as set forth in claim 3, wherein the openings are uniformly arrayed in a top plate of the socket head.

5. The test socket as set forth in claim 2, wherein the socket head further comprises a central opening that penetrates a central portion of the socket head.

6. The test socket as set forth in claim 1, further comprising a temperature sensor disposed to be adjacent the semiconductor package.

7. A method of testing a semiconductor package, the method comprising:

i) providing a test socket having a socket body, a socket head disposed on the socket body for combination with the socket body, a Peltier element in the socket head, and power terminals connected to the Peltier element;

ii) inserting a semiconductor package into the socket body;

iii) applying a first voltage to the power terminals to generate heat from the Peltier element, the heat from the Peltier element being conducted to the semiconductor package;

iv) operating the semiconductor package;

v) testing the semiconductor package; and

vi) replacing the semiconductor package that has been tested with a new semiconductor package to be tested.

8. The method as set forth in claim 7, further comprising sequentially and repeatedly performing the steps iv) to vi).

9. The method as set forth in claim 7, further comprising applying a second voltage to the power terminals to cool down the semiconductor package after the step v), wherein the second voltage has an opposite polarity to the first voltage.

10. The method as set forth in claim 7, wherein the socket head is provided to have a thermal conductive plate disposed between the semiconductor package in the socket body and the Peltier element in the socket head, and provided to have a plurality of openings formed therein.

11. A test equipment comprising:

a test unit having a test socket in which a semiconductor package is located;

a temperature sensing unit connected to the test unit to indicate a temperature of the semiconductor package; and

a control unit connected to the temperature sensing unit to control the test unit, wherein the test socket comprises;

a socket body in which the semiconductor package is located;

a socket head combined with the socket body;

a Peltier element arranged in the socket head to be adjacent the semiconductor package; and

power terminals connected to the Peltier element.

12. The test equipment as set forth in claim 11, wherein the socket head comprises a plate disposed between the Peltier element in the socket head and the semiconductor package in the socket body, and wherein the plate between the Peltier element and the semiconductor package comprises a thermal conductive material.

13. The test equipment as set forth in claim 12, wherein the socket head comprises a plurality of openings.

14. The test equipment as set forth in claim 13, wherein the openings are uniformly arrayed in a top plate of the socket head.

15. The test equipment as set forth in claim 12, wherein the socket head further comprises a central opening that penetrates a central portion of the socket head.

16. The test equipment as set forth in claim 11, further comprising a temperature sensor disposed in the socket body to be adjacent the semiconductor package.