Wireless Identification Device, RFID Device with Push-on/Push-off Switch, and Method of Manufacturing Wireless Identification Device

• US 20080174438A1
• Filed: 09/13/2007
• Published: 07/24/2008
• Est. Priority Date: 10/03/1997
• Status: Abandoned Application

• Current Assignee: Round Rock Research LLC
• Original Assignee: Round Rock Research LLC
• Inventors: Tuttle, Mark E.
• Application Number:
  US11/855,029
• Publication Number:
  US 20080174438A1
• Time in Patent Office: Days
• US Class Current: 340/572.8
• CPC Class Codes: G06K 19/0716 at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07345 by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01H 2231/05 Card, e.g. credit card
• CPC Class Codes: H01Q 21/28 Combinations of substantially independent non-interacting antenna units or systems multiple beam H01Q25/00
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/16 with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A wireless identification device including a housing; circuitry in the housing configured to provide a signal to identify the device in response to an interrogation signal; and a selectively actuated switch supported by the housing and controlling whether the circuitry identifies the device. A method of manufacturing a wireless identification device, the method comprising configuring circuitry to provide a signal to identify the device in response to an interrogation signal; coupling the circuitry to a push-on/push-off switch supported by the housing and controlling whether the circuitry provides the signal to identify the device; and encasing the circuitry in a housing such that the switch is actuable from outside the housing by touching a portion of the housing.

Claims

1-4. -4. (canceled)

5. A method for forming a radio frequency identification (RFID) device, comprising:

providing a layer of supporting material that is transparent having a thickness of less than ten one thousandths of an inch;

disposing on the supporting material conductors forming one or more antennas having electrical connections;

disposing adjacent the supporting material a monolithic radio frequency transceiver integrated circuit comprising a radio frequency transmitter for communicating radio frequency signals, a radio frequency receiver for receiving radio frequency signals, a microprocessor, and a memory for storing data including data that is unique to the particular RFID device;

providing a power source for supplying power to the radio frequency transceiver integrated circuit; and

coupling the radio frequency transceiver integrated circuit to the electrical connections of the one or more antennas.

6. The method of claim 5, wherein providing the supporting material further comprises providing polyester film.

7. The method of claim 5, wherein providing the supporting material further comprises disposing visible indicia disposed on a surface of the supporting material.

8. The method of claim 5, wherein providing one or more antennas comprises disposing conductive material on a surface of the supporting material.

9. The method of claim 5, wherein disposing a monolithic radio frequency transceiver integrated circuit further comprises disposing a monolithic radio frequency transceiver integrated circuit having a transmitter operable to communicate by backscatter reflection of received radio frequency signals.

10. The method of claim 5, wherein providing a power source further comprises providing a passive power source operable to provide power to the radio frequency transceiver integrated circuit in the presence of radio frequency signals.

11. The method of claim 5, wherein providing a power source further comprises providing a battery disposed adjacent the supporting material and coupled to the radio frequency transceiver integrated circuit.

12. The method of claim 11, wherein disposing the radio frequency transceiver integrated circuit further comprises disposing a radio frequency transceiver integrated circuit having a transmitter operable to actively transmit radio frequency signals.

13. The method of claim 11, wherein providing a battery further comprises providing a thin film battery.

14. A method for manufacturing a plurality of RFID devices, comprising:

providing a layer of supporting material that is transparent and less than five one thousandths of an inch thick;

defining portions of the layer of supporting material to form individual RFID devices;

disposing within each portion one or more antennas having connection terminals;

disposing within each portion and adjacent the layer of supporting material a monolithic radio frequency transceiver integrated circuit comprising a radio frequency receiver for receiving radio frequency signals, a radio frequency transmitter for communicating radio frequency signals, control logic, and a memory for persistently storing data;

providing a power supply within each portion to supply power to the monolithic radio frequency transceiver integrated circuit;

coupling in each portion the connection terminals to the respective monolithic radio frequency transceiver integrated circuit;

providing a protective coating in each portion disposed to protect the monolithic radio frequency transceiver integrated circuit; and

modifying the layer of supporting material to separate the portions into separate RFID devices.

15. The method of claim 14, wherein providing a layer of supporting material further comprises disposing visible indicia on a surface of the supporting material.

16. The method of claim 14, wherein providing the layer of supporting material further comprises providing a polyester film.

17. The method of claim 14, wherein disposing within each portion one or more antennas further comprises disposing one or more dipole antennas.

18. The method of claim 14, wherein disposing within each portion one or more antennas further comprises disposing conductive material patterned to form the antennas.

19. The method of claim 18, wherein coupling in each portion the connection terminals to the respective monolithic radio frequency transceiver integrated circuit further comprises disposing a conductive epoxy physically connecting the connection terminals to the monolithic radio frequency transceiver integrated circuit.

20. The method of claim 14, wherein providing a protective coating in each portion disposed to protect the monolithic radio frequency transceiver integrated circuit further comprises dispensing an encapsulant in each portion.

21. The method of claim 14, wherein disposing within each portion and adjacent the layer of supporting material a monolithic radio frequency transceiver integrated circuit further comprises disposing a monolithic radio frequency transceiver integrated circuit comprising a radio frequency signal transmitter operable to communicate radio frequency signals by backscatter reflection of received radio frequency signals.

22. The method of claim 21, wherein the radio frequency transmitter is further operable to modulate the backscattered radio frequency signals.

23. The method of claim 14, wherein providing a power supply within each portion further comprises providing a thin film battery within each portion coupled to supply power to the a monolithic radio frequency transceiver integrated circuit.

24. The method of claim 23, wherein disposing within each portion and adjacent the layer of supporting material a monolithic radio frequency transceiver integrated circuit further comprises disposing a monolithic radio frequency transceiver integrated circuit comprising a radio frequency signal transmitter operable to actively transmit radio frequency signals.

25. The method of claim 14, wherein disposing within each portion and adjacent the layer of supporting material a monolithic radio frequency transceiver integrated circuit further comprises providing the control logic as a microprocessor operable to interpret commands received as radio frequency signals at the radio frequency receiver, operable to retrieve data stored in the persistent memory in response to the received and interpreted commands, and operable to communicate the retrieved data as a radio frequency signal via the radio frequency transmitter.

26. The method of claim 25, wherein the retrieved data includes data stored in the persistent memory.