Circuit Module and process for producing the same
First Claim
1. A circuit module comprising a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder,the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween,the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pad, andthe dents being joined to the ceramic substrate pads with solder.
1 Assignment
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Accused Products
Abstract
A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder.
11 Citations
6 Claims
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1. A circuit module comprising a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder,
the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pad, and the dents being joined to the ceramic substrate pads with solder.
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2. A circuit module comprising a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with electroconductive resin,
the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pad, and the dents being joined to the ceramic substrate pads with the electroconductive resin.
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3. A process for producing a circuit module comprising steps, carried out in this order, of:
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preparing a ceramic carrier substrate having a ceramic substrate pads and being capable of mounting electronic parts; forming solder paste layers on the ceramic substrate pads; forming precoated solder layers by heating the ceramic carrier substrate having the solder paste layers on the ceramic substrate pads to melt the solder paste layers, and then cooling for solidifying the solder; preliminarily fixing the stepped lid having protrusions adjacent to a cavity and dents adjacent to the cavity with the protrusions intervening therebetween to the precoated solder layers of the ceramic carrier substrate; and joining the stepped lid to the ceramic carrier substrate with solder by placing the ceramic carrier substrate having the stepped lid preliminarily fixed to the precoated solder layers in a reflow furnace. - View Dependent Claims (4)
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5. A process for producing a circuit module comprising steps, carried out in this order, of:
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preparing a ceramic carrier substrate having a ceramic substrate pads and being capable of mounting electronic parts; forming not hardened electroconductive resin layers on the ceramic substrate pads; forming solid precoated electroconductive resin layers by heating the ceramic carrier substrate having the electroconductive resin layers formed thereon to semi-harden the electroconductive resin; and joining the stepped lid having protrusions adjacent to a cavity and dents adjacent to the cavity with the protrusions intervening therebetween to the ceramic carrier substrate by mounting the stepped lid and the ceramic carrier substrate having the precoated electroconductive resin layers formed thereon to a mounter equipped with a heating mechanism, making the stepped lid into contact with the precoated electroconductive resin layer with the mounter equipped with the heating mechanism, and heating the stepped lid and the ceramic carrier substrate having the precoated electroconductive resin layers formed thereon to harden the precoated electroconductive resin layers. - View Dependent Claims (6)
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Specification