Microphone System with Silicon Microphone Secured to Package Lid

• US 20080175425A1
• Filed: 11/29/2007
• Published: 07/24/2008
• Est. Priority Date: 11/30/2006
• Status: Abandoned Application

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Sullivan, Richard J., Sengupta, Dipak, Harney, Kieran P., Grusby, Alvin, Roberts, Carl M.
• Application Number:
  US11/947,192
• Publication Number:
  US 20080175425A1
• Time in Patent Office: Days
• US Class Current: 381/361
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2499/11 : Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Abstract

A microphone system has a base with at least one electrical port for electrically communicating with an external device. The system also has a solid metal lid coupled to the base to form an internal chamber, and a silicon microphone secured to the lid within the chamber. The lid has an aperture for receiving an audible signal, while the microphone is electrically connected to the electrical port of the base.

Claims

1. A microphone system comprising:

a base having at least one electrical port for electrically communicating with an external device;

a solid metal lid coupled to the base, the lid and base forming an internal chamber, the lid having at least one aperture for receiving an audible signal; and

a silicon microphone secured to the lid within the chamber, the microphone being electrically connected to the electrical port of the base.

2. The microphone system as defined by claim 1 wherein the microphone is secured about at least one aperture.

3. The microphone system as defined by claim 1 wherein the microphone also is secured to the base.

4. The microphone system as defined by claim 3 wherein a bump secures the microphone to the base and at least in part electrically connects the microphone with the electrical port of the base.

5. The microphone system as defined by claim 3 wherein a low modulus epoxy secures the lid to the base.

6. The microphone system as defined by claim 1 wherein the base comprises a substrate package base or a laminate package base.

7. The microphone system as defined by claim 1 further comprising a chip secured within the chamber, the chip electrically communicating with the microphone.

8. The microphone system as defined by claim 7 wherein the chip and microphone are in a stacked configuration.

9. The microphone system as defined by claim 7 wherein the chip and microphone are in a side-by-side configuration.

10. The microphone system as defined by claim 1 wherein the external device comprises a printed circuit board that is physically and electrically connected to the electrical port of the base.

11. The microphone system as defined by claim 1 wherein a bump electrically connects the silicon microphone with the base.

12. A top port microphone system comprising:

a package comprising a base coupled with a solid metal lid, the lid and base forming an internal chamber, the lid having at least one aperture for receiving an audible signal; and

a silicon microphone secured to the lid within the chamber, the microphone being connected about at least one aperture.

13. The microphone system as defined by claim 12 wherein the base has an inner surface and an outer surface, the inner surface at least in part of forming the chamber, the outer surface having an electrical port for communicating with an external device, the microphone being electrically connected with the electrical port.

14. The microphone system as defined by claim 13 further comprising a bump that physically connects the microphone with the base, the bump also at least in part electrically connecting the microphone with the electrical port.

15. The microphone system as defined by claim 12 wherein the microphone also is secured to the base.

16. The microphone system as defined by claim 12 wherein a low modulus epoxy secures the lid to the base.

17. A method of forming a microphone system, the method comprising:

providing a solid metal lid with at least one aperture;

securing the solid metal lid to a base to form an interior chamber; and

securing a silicon microphone about the at least one aperture within the interior chamber.

18. The method as defined by claim 17 wherein the act of securing the metal lid secures the silicon microphone about at least one aperture.

19. The method as defined by claim 17 wherein the silicon microphone is secured about at least one aperture before the metal lid is secured to the base.

20. The method as defined by claim 17 further comprising securing the base to a printed circuit board.

21. The method as defined by claim 17 wherein a low modulus epoxy secures the lid to the base.

22. A microphone system comprising:

a base having at least one electrical port for electrically communicating with an external device;

a lid coupled to the base, the lid and base forming an internal chamber;

a silicon microphone secured to the lid within the chamber;

an electrical connector extending through the interior chamber to contact the base, the electrical connector electrically connecting the microphone to the electrical port of the base.

23. The microphone system as defined by claim 22 wherein the lid comprises material having electrical interconnects.

24. The microphone system as defined by claim 22 wherein the lid comprises a solid metal lid.

25. The microphone system as defined by claim 22 wherein the electrical connector comprises a bump mechanically connected with the base.

28. The microphone system as defined by claim 22 wherein lid forms at least one aperture for receiving audio signals, the microphone being secured over at least one aperture.

26. The microphone system as defined by claim 26 wherein the bump extends between the microphone and the base.

27. The microphone system as defined by claim 26 further comprising a chip secured within the chamber, the chip electrically communicating with the microphone, the bump being mechanically connected with the circuit.