Solder Composition

• US 20080175748A1
• Filed: 03/10/2008
• Published: 07/24/2008
• Est. Priority Date: 08/12/2005
• Status: Abandoned Application

• Current Assignee: Antaya Technologies Corporation (Aptiv PLC)
• Original Assignee: Antaya Technologies Corporation (Aptiv PLC)
• Inventors: Pereira, John
• Application Number:
  US12/045,322
• Publication Number:
  US 20080175748A1
• Time in Patent Office: Days
• US Class Current: 420/555
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: B23K 20/10 making use of vibrations, e.g. ultrasonic welding
• CPC Class Codes: B23K 2101/38 Conductors
• CPC Class Codes: B23K 35/262 Sn as the principal constituent
• CPC Class Codes: C03C 17/36 at least one coating being a metal
• CPC Class Codes: C03C 17/3673 specially adapted for use in heating devices for rear window of vehicles
• CPC Class Codes: C03C 27/046 of metals, metal oxides or metal salts only
• CPC Class Codes: C22C 13/00 Alloys based on tin
• CPC Class Codes: C22C 28/00 Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00

Abstract

A solder composition having a mixture of elements including tin, indium, silver, and bismuth, and can include about 30% to 85% tin and about 15% to 65% indium.

Claims

1. A solder composition having a mixture of elements comprising tin, indium silver and bismuth, and including above 30% tin to 85% tin, below 65% indium to 15% indium, and above 0.25% up to about 6% bismuth.

2. The solder composition of claim 1 further comprising copper.

3. The solder composition of claim 2 in which the composition includes about 1% to 10% silver, and about 0.25% to 0.75% copper.

4. The solder composition of claim 2 in which the composition includes about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper.

5. The solder composition of claim 4 in which the composition includes about 35% to 75% tin, and about 15% to 60% indium.

6. The solder composition of claim 4 in which the composition includes about 35% to 65% tin, and about 30% to 60% indium.

7. The solder composition of claim 2 in which the composition comprises about 37% to 42% tin, about 53% to 57% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper.

8. The solder composition of claim 7 in which the composition comprises about 39% tin, about 55% indium, about 4% silver, about 1.5% bismuth, and about 0.5% copper.

9. The solder composition of claim 2 in which the composition comprises about 47% to 52% tin, about 40% to 47% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper.

10. The solder composition of claim 9 in which the composition comprises about 49% tin, about 45% indium, about 4% silver, about 1.5% bismuth, and about 0.5% copper.

11. The solder composition of claim 2 in which the solder composition comprises about 58% to 63% tin, about 28% to 37% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper.

12. The solder composition of claim 11 in which the composition comprises about 60% tin, about 35% indium, about 3% silver, about 1.5% bismuth, and about 0.5% copper.

13. The solder composition of claim 2 in which the composition comprises about 69% to 75% tin, about 17% to 27% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper.

14. The solder composition of claim 13 in which the composition comprises about 71% tin, about 25% indium, about 2% silver, about 1.5% bismuth, and about 0.5% copper.

15. A method of forming a solder composition comprising mixing tin, indium silver and bismuth together, and including above 30% tin to 85% tin, below 65% indium to 15% indium, and above 0.25% up to about 6% bismuth.

16. The method of claim 15 further comprising mixing copper.

17. The method of claim 16 further comprising mixing about 1% to 10% silver, and about 0.25% to 0.75% copper.

18. The method of claim 16 further comprising mixing about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper.

19. The method of claim 18 further comprising mixing about 35% to 75% tin, and about 15% to 60% indium.

20. The method of claim 18 further comprising mixing about 35% to 65% tin, and about 30% to 60% indium.

21. The method of claim 16 further comprising mixing about 37% to 42% tin, about 53% to 57% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper.

22. The method of claim 21 comprising mixing about 39% tin, about 55% indium, about 4% silver, about 1.5% bismuth, and about 0.5% copper.

23. The method of claim 16 further comprising mixing about 47% to 52% tin, about 40% to 47% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper.

24. The method of claim 23 further comprising mixing about 49% tin, about 45% indium, about 4% silver, about 1.5% bismuth, and about 0.5% copper.

25. The method of claim 16 further comprising mixing about 58% to 63% tin, about 28% to 37% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper.

26. The method of claim 25 further comprising mixing about 60% tin, about 35% indium, about 3% silver, about 1.5% bismuth and about 0.5% copper.

27. The method of claim 16 further comprising mixing about 69% to 75% tin, about 17% to 27% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper.

28. The method of claim 27 further comprising mixing about 71% tin, about 25% indium, about 2% silver, about 1.5% bismuth, and about 0.5% copper.