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Solder Composition

  • US 20080175748A1
  • Filed: 03/10/2008
  • Published: 07/24/2008
  • Est. Priority Date: 08/12/2005
  • Status: Abandoned Application
First Claim
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1. A solder composition having a mixture of elements comprising tin, indium silver and bismuth, and including above 30% tin to 85% tin, below 65% indium to 15% indium, and above 0.25% up to about 6% bismuth.

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