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Apparatus for high throughput chemical reactions

  • US 20080176290A1
  • Filed: 01/22/2008
  • Published: 07/24/2008
  • Est. Priority Date: 01/22/2007
  • Status: Active Grant
First Claim
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1. An apparatus comprising at least one heating element, configured to be in thermal contact with a chip said chip comprising a substrate and an array of nanowells, wherein the at least one heating element is configured to move relative to the chip.

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