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Method of manufacturing semiconductor device

  • US 20080176407A1
  • Filed: 01/23/2008
  • Published: 07/24/2008
  • Est. Priority Date: 01/24/2007
  • Status: Abandoned Application
First Claim
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1. A method of manufacturing a semiconductor device comprising:

  • forming a film on a semiconductor wafer;

    forming a mask film on the film;

    etching the film using the mask; and

    cleaning the wafer after etching the film, the cleaning step including a sequence supplying removing solution to the wafer while a removal step having plural operations including rotating the wafer at a first number of rotation and a rotating the wafer at a second number of rotation which is larger than the first number of rotation is performed,wherein the total time of supplying the removing solution in the cleaning step is 45 seconds or less.

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