Atomic layer deposition system including a plurality of exhaust tubes

• US 20080176412A1
• Filed: 01/22/2008
• Published: 07/24/2008
• Est. Priority Date: 01/22/2007
• Status: Abandoned Application

• Current Assignee: PS4 Luxco S.a.r.l.
• Original Assignee: Elpida Memory Incorporated (Micron Technology, Inc.)
• Inventors: Komeda, Kenji
• Application Number:
  US12/010,149
• Publication Number:
  US 20080176412A1
• Time in Patent Office: Days
• US Class Current: 438/778
• CPC Class Codes: C23C 16/4412 Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
• CPC Class Codes: C23C 16/45527 characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations

Abstract

An atomic layer deposition system includes a reaction chamber, a plurality of exhaust tubes communicated to the reaction chamber, a plurality of first vacuum gauges for monitoring the degree of vacuum of the respective exhaust tubes, a second vacuum gauge for monitoring the degree of vacuum of the reaction chamber, and control valves for adjusting the exhaust volume of the exhaust tubes independently of one another. The control valves are controlled based on the pressures measured by the first and second control valves for achieving a uniform flow of the vapor phase reactant.

Claims

1. An in-line atomic layer deposition (ALD) system for depositing a film by using an ALD process while alternately introducing a plurality of vapor phase reactants, comprising:

a reaction chamber;

a stage arranged in said reaction chamber for mounting thereon a semiconductor wafer; and

a plurality of exhaust tubes provided in a vicinity of a periphery of said stage, said exhaust tubes capable of being controlled in an exhaust volume thereof independently of one another,

wherein each of said exhaust tubes includes therein a control valve for adjusting the exhaust volume, and the open angle of each said control valve is controlled depending on a pressure measured by a first vacuum gauge that is arranged at upstream of each of said control valves to measure a degree of vacuum in each of said exhaust tubes.

2. The in-line ALD system according to claim 1, wherein said control valves each are a pressure-control rotary valve, and an open angle of each said pressure-control rotary valve is controlled to an arbitrary angle in the range of 0 to 90 degrees.

3. The in-line ALD system according to claim 2, wherein the open angle of each said pressure-control rotary valve is further controlled depending on a pressure measured by a second vacuum gauge that measures a degree of vacuum in said reaction chamber.

4. The in-line ALD system according to claim 3, wherein the pressure measured by said second vacuum gauge is controlled so as to be a preset pressure, and the open angle of each said pressure-control rotary valve is controlled so that the exhaust volumes of said exhaust tubes assume an equal value.

5. The in-line ALD system according to claim 4, wherein said exhaust tubes each include a bypass line for bypassing corresponding said pressure-control rotary valve.

6. The in-line ALD system according to claim 5, wherein each said bypass line includes therein an isolation valve which is controlled for an opening/closing state thereof depending on the pressure measured by said second vacuum gauge.

7. The in-line ALD system according to claim 6, wherein a flow of a vapor phase reactant is controlled by using said pressure-control rotary valves while closing each said isolation valve during a depositing time interval for depositing the film by using the ALD process, and each said isolation valve is opened to discharge the gas by using said bypass line during a time interval other than said depositing time interval.

8. The in-line ALD system according to claim 7, wherein the open angle of each said pressure-control rotary valve is changed to an optimum angle to be used for a subsequent time interval, while discharging the gas by opening each said isolation valve and using each said bypass line.

9. A method for depositing an insulation film by using an in-line atomic layer deposition (ALD) system including a reaction chamber, a stage arranged in said reaction chamber for mounting thereon a semiconductor wafer, and a plurality of exhaust tubes provided on a periphery of said stage, said exhaust tubes each including therein a control valve for adjusting the exhaust volume and a first vacuum gage arranged at upstream of said control valve for measuring a degree of vacuum in a corresponding one of said exhaust tubes, said method comprising the steps of:

alternately introducing a plurality of vapor phase reactants into said reactor chamber;

controlling said exhaust tubes in an exhaust volume thereof independently from one another by using said control valve during evacuation of at least one of the vapor phase reactants; and

controlling an open angle of each said control valve depending on a pressure measured by each said first vacuum gauge, to thereby control a direction of flow of said vapor phase reactant in said reaction chamber.

10. The method of depositing an insulation film according to claim 9, wherein preparation of a process condition for depositing the insulation film includes the step of optimizing an open angle of each said control valve to equalize the flow of the vapor phase reactant in each deposition step of the ALD process.

11. The method of depositing an insulation film according to claim 10, wherein a gas to be fed into the reaction chamber in the procedure for optimizing the open angle of each said control valve is identical to the vapor phase reactant used for forming the actual film.

12. The method of depositing an insulation film according to claim 10, wherein a gas to be fed into the reaction chamber in the procedure for optimizing the open angle of each said control valve is an arbitrary gas linked to said deposition system.

13. The method of depositing an insulation film according to claim 10, wherein, in a deposition time interval of the insulation film, the optimum open angle determined in the procedure for optimizing the open angle of each said control valve is used as a setup parameter of the open angle for each step, and the open angle of each said control valve is changed in accordance with a timing at which each step is switched over to a next step.

14. The method of depositing an insulation film according to claim 10, wherein, in a deposition time interval of the insulation film, the open angle of each said control valve is controlled by using a pressure measured by a second vacuum gauge arranged in said reaction chamber and the pressure measured by each said first vacuum gauge, in accordance with a timing at which each step is switched over to a next step.

15. The method of depositing an insulation film according to claim 10, wherein, in a deposition time interval of the insulation film, the optimum open angle determined in the procedure for optimizing the open angle of each said control valves is used as a setup parameter of the open angle for each step, and the open angle of each said control valve is changed to an optimum angle in accordance with a timing at which each step is switched over to a next step, and thereafter, the open angle of each said control valve is controlled by using a pressure measured by a second vacuum gauge arranged in said reaction chamber and the pressure measured by said first vacuum gauges.

16. The method of depositing an insulation film according to claim 10, wherein change of the open angle of each said control valve used in a deposition time interval of the insulation film is performed in a step which does not deposit the insulation film.

17. The method of depositing an insulation film according to claim 10, wherein the change of the open angle of each said control valve used in a deposition time interval of the insulation film is performed in steps before or after the steps which do not deposit the insulation film.

18. The method of depositing an insulation film according to claim 10, wherein the open angle of each said control valve in the step which does not deposit the insulation film is set to be fully open.

19. The method of depositing an insulation film according to claim 10, wherein the open angle of each said control valve in the step which does not deposit the insulation film is set to the optimum open angle for the subsequent step.