Electronic Textiles with Electronic Devices on Ribbons

• US 20080178453A1
• Filed: 01/29/2008
• Published: 07/31/2008
• Est. Priority Date: 01/29/2007
• Status: Active Grant

• Current Assignee: Board of Regents of the University of Texas System (University of Texas System)
• Original Assignee: Board of Regents of the University of Texas System (University of Texas System)
• Inventors: Gnade, Bruce
• Granted Patent: US 7,820,497 B2
• Time in Patent Office: Days
• US Class Current: 29/428
• CPC Class Codes: D03D 1/0088 Fabrics having an electronic function
• CPC Class Codes: D03D 15/46 Flat yarns, e.g. tapes or films
• CPC Class Codes: D10B 2101/20 Metallic fibres
• CPC Class Codes: D10B 2401/041 thermoplastic; thermosetting
• CPC Class Codes: D10B 2401/16 antistatic; conductive
• CPC Class Codes: G11C 13/0014 comprising cells based on organic memory material
• CPC Class Codes: G11C 17/16 using electrically-fusible links
• CPC Class Codes: G11C 17/18 Auxiliary circuits, e.g. for writing into memory
• CPC Class Codes: H10K 19/10 comprising field-effect transistors
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

Ribbons containing e.g. inorganic NMOS devices are assembled in electrical contact with ribbons containing e.g. PMOS devices (preferably organic) to enable flexible electronic textile circuits to be inexpensive and practical for a wide variety of functions. The use of ribbons provides flexibility, reduces costs, and allows testing during assembly and different processes to be efficiently used for different components. This is apparently the first time that ribbons (especially inorganic-device-containing ribbons) have been interconnected to form a flexible CMOS electronic textile.

Claims

1. A method of assembling an active CMOS circuit containing an electronic textile;

comprising;

providing ribbons containing PMOS transistors;

providing ribbons containing inorganic NMOS transistors; and

attaching said PMOS organic transistor ribbons in electrical contact with said inorganic NMOS transistors ribbons to provide a CMOS electronic textile.

2. The method of claim 1, wherein said ribbons containing organic transistors and said ribbons containing inorganic transistor are substantially parallel or substantially perpendicular.

3. The method of claim 1, wherein said PMOS containing ribbons are woven with said NMOS containing ribbons.

4. The method of claim 1, wherein said ribbons are attached to a backing.

5. The method of claim 1, wherein said textile contains at least one capacitor.

6. The method of claim 5, wherein said capacitor has a hafnium silicate dielectric.

7. A method of providing an electronic textile, comprising:

providing ribbons containing thin-film transistors; and

placing said ribbons in direct or indirect electrical contact to electrically interconnect said ribbons to provide an electronic textile with static memory cells.

8. The method of claim 7, wherein said textile contains ribbons with inorganic thin-film transistors.

9. The method of claim 7, wherein said textile contains ribbons with organic transistors.

10. The method of claim 7, wherein said textile contains ribbons with memory cells having inorganic thin-film transistors, and ribbons with memory cells having organic transistors.

11. The method of claim 10, wherein ribbons with inorganic transistors, are substantially parallel to ribbons with organic transistors.

12. The method of claim 10, wherein ribbons with inorganic transistors, are substantially perpendicular to ribbons with organic transistors.

13. The method of claim 7, wherein said thin-film transistors are lithographically fabricated.

14. A method of assembling an electronic textile;

comprising;

providing ribbons containing non-single-crystal inorganic semiconductor devices directly or indirectly electrically connected to surface contacts; and

assembling said ribbons with electrical interconnections through said surface contacts into an electronic textile.

15. The method of claim 14, wherein ribbons containing active organic semiconductor devices are in direct or indirect electrical contact with said inorganic semiconductor ribbons.

16. The method of claim 14, wherein said inorganic semiconductor containing ribbons comprise at least one of inorganic semiconductor transistors and inorganic semiconductor diodes.

17. The method of claim 15, wherein said active organic containing ribbons comprise LEDs.

18. The method of claim 15, wherein said active organic semiconductor devices comprise transistors.