Flexible heat cable device
First Claim
1. A cooling apparatus for cooling an electronic device to be cooled, comprising:
- a) a heat collector device which is adapted to be in thermal contact with the electronic device;
b) a heat sink for absorbing heat which is emitted from the heat collector device and comprising a condenser unit and a thermal interface unit, wherein the condenser unit is cooled down via the thermal interface unit;
c) a heat transfer device made from a flexible material for transferring heat which is emitted from the heat collector device to the heat sink, whereind) the thermal interface unit is designed as a thermal plug for connecting the condenser unit of the heat sink thermally and removably to an external cooling means.
1 Assignment
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Accused Products
Abstract
A cooling apparatus for cooling an electronic device to be cooled includes a heat collector device which is in thermal contact with the electronic device, a heat sink for absorbing heat which is emitted from the heat collector device and comprising a condenser unit and a thermal interface unit, wherein the condenser unit is cooled down via the thermal interface unit, and a heat transfer device made from a flexible material for transferring heat which is emitted from the heat collector device to the heat sink. The thermal interface unit is designed as a thermal plug for connecting the condenser unit of the heat sink thermally and removably to an external cooling means.
28 Citations
15 Claims
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1. A cooling apparatus for cooling an electronic device to be cooled, comprising:
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a) a heat collector device which is adapted to be in thermal contact with the electronic device; b) a heat sink for absorbing heat which is emitted from the heat collector device and comprising a condenser unit and a thermal interface unit, wherein the condenser unit is cooled down via the thermal interface unit; c) a heat transfer device made from a flexible material for transferring heat which is emitted from the heat collector device to the heat sink, wherein d) the thermal interface unit is designed as a thermal plug for connecting the condenser unit of the heat sink thermally and removably to an external cooling means. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for cooling an electronic device to be cooled, comprising the following steps:
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a) collecting heat from the electronic device to be cooled by a heat collector device which is in thermal contact with the electronic device to be cooled; b) transferring heat which is emitted from the heat collector device to a heat sink by means of a heat transfer device made from a flexible material c) absorbing heat which is emitted from the heat collector device by means of the heat sink comprising a condenser unit and a thermal interface unit, the thermal interface unit being a thermal plug for connecting the condenser unit of the heat sink thermally and removably to an external cooling means; and d) cooling down the condenser unit via the thermal interface unit. - View Dependent Claims (12, 13, 14)
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15. A cooling apparatus, comprising:
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a) a heat collector device adapted for a thermal contact; b) a heat sink for absorbing emitted heat, the heat sink including a condenser unit and a thermal interface unit; c) a heat transfer device formed of a flexible material for transferring heat from the heat collector device to the heat sink; and d) an external cooling means, wherein the thermal interface unit is configured as a thermal plug for connecting the condenser unit of the heat sink thermally and removably to the external cooling means.
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Specification