Flexible heat cable device

• US 20080179047A1
• Filed: 12/20/2007
• Published: 07/31/2008
• Est. Priority Date: 12/23/2006
• Status: Abandoned Application

• Current Assignee: ABB Research Ltd. (ABB Ltd.)
• Original Assignee: ABB Research Ltd. (ABB Ltd.)
• Inventors: Yesin, Berk, Balta, Jose, Jylhakallio, Mervi, Kauhanen, Matti
• Application Number:
  US12/004,037
• Publication Number:
  US 20080179047A1
• Time in Patent Office: Days
• US Class Current: 165/104.33
• CPC Class Codes: F28D 15/0241 the tubes being flexible
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28F 2250/08 Fluid driving means, e.g. pumps, fans
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling apparatus for cooling an electronic device to be cooled includes a heat collector device which is in thermal contact with the electronic device, a heat sink for absorbing heat which is emitted from the heat collector device and comprising a condenser unit and a thermal interface unit, wherein the condenser unit is cooled down via the thermal interface unit, and a heat transfer device made from a flexible material for transferring heat which is emitted from the heat collector device to the heat sink. The thermal interface unit is designed as a thermal plug for connecting the condenser unit of the heat sink thermally and removably to an external cooling means.

Claims

1. A cooling apparatus for cooling an electronic device to be cooled, comprising:

a) a heat collector device which is adapted to be in thermal contact with the electronic device;

b) a heat sink for absorbing heat which is emitted from the heat collector device and comprising a condenser unit and a thermal interface unit, wherein the condenser unit is cooled down via the thermal interface unit;

c) a heat transfer device made from a flexible material for transferring heat which is emitted from the heat collector device to the heat sink, wherein

d) the thermal interface unit is designed as a thermal plug for connecting the condenser unit of the heat sink thermally and removably to an external cooling means.

2. The cooling apparatus for cooling an electronic device as claimed in claim 1, wherein the heat transfer device includes an electrical connection unit to simultaneously transfer thermal and electrical energy between the electronic device and the heat sink.

3. The cooling apparatus for cooling an electronic device as claimed in claim 1, wherein the electronic device forms an integral unit with the heat collector device.

4. The cooling apparatus for cooling an electronic device as claimed in claim 1, wherein the heat transfer device is made of a thermoplastic polymer.

5. The cooling apparatus for cooling an electronic device as claimed in claim 1, wherein the heat transfer device is made of at least one of polyethylene, polyethylene-terephthalate and polystyrene.

6. The cooling apparatus for cooling an electronic device as claimed in claim 1, wherein the heat transfer device includes a metal layer deposited on the outer surface of the heat transfer device.

7. The cooling apparatus for cooling an electronic device as claimed in claim 1, wherein the heat transfer device is made of super-elastic alloys.

8. The cooling apparatus for cooling an electronic device as claimed in claim 1, wherein the condenser unit comprises a pump unit for pumping back liquid, which has been collected in a condensate collector.

9. The cooling apparatus for cooling an electronic device as claimed in claim 8, wherein the pump unit of the condenser unit is driven by the flow of cooling water.

10. The cooling apparatus for cooling an electronic device as claimed in claim 1, wherein the heat collector device, the heat sink and the heat transfer device form a thermosyphon device.

11. A method for cooling an electronic device to be cooled, comprising the following steps:

a) collecting heat from the electronic device to be cooled by a heat collector device which is in thermal contact with the electronic device to be cooled;

b) transferring heat which is emitted from the heat collector device to a heat sink by means of a heat transfer device made from a flexible material

c) absorbing heat which is emitted from the heat collector device by means of the heat sink comprising a condenser unit and a thermal interface unit, the thermal interface unit being a thermal plug for connecting the condenser unit of the heat sink thermally and removably to an external cooling means; and

d) cooling down the condenser unit via the thermal interface unit.

12. The method for cooling an electronic device to be cooled as claimed in claim 11, wherein the heat sink is cooled by a secondary circulation of cooling water.

13. The method for cooling an electronic device to be cooled as claimed in claim 11, wherein the heat transfer device transfers heat from the heat collector device to the heat sink by transporting a liquid coolant from the heat collector device to the heat sink and by returning evaporated coolant from the heat sink to the heat collector device.

14. The method for cooling an electronic device to be cooled as claimed in claim 12, wherein the condenser unit of the heat sink is directly cooled by the circulating cooling water.

15. A cooling apparatus, comprising:

a) a heat collector device adapted for a thermal contact;

b) a heat sink for absorbing emitted heat, the heat sink including a condenser unit and a thermal interface unit;

c) a heat transfer device formed of a flexible material for transferring heat from the heat collector device to the heat sink; and

d) an external cooling means, wherein the thermal interface unit is configured as a thermal plug for connecting the condenser unit of the heat sink thermally and removably to the external cooling means.