Direct Applied Monolithic Printed Circuit Technology
First Claim
Patent Images
1. An electronic circuit, comprising:
- a non-conductive substrate;
a conductive adhesive adhered to the substrate in a pattern; and
at least one electronic component supported by and electrically connected via the conductive adhesive.
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Abstract
An electronic circuit board is provided. The electronic circuit board includes a substrate and a conductive adhesive adhered to the substrate in a trace pattern. The conductive adhesive mechanically supports and electrically connects an electronic component.
9 Citations
20 Claims
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1. An electronic circuit, comprising:
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a non-conductive substrate; a conductive adhesive adhered to the substrate in a pattern; and at least one electronic component supported by and electrically connected via the conductive adhesive. - View Dependent Claims (4, 5, 6)
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7. An apparatus, comprising:
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a housing having an internal surface; a conductive adhesive adhered to the internal surface; and at least one electronic component mechanically supported by and electrically connected via the conductive adhesive to form a first electronic circuit. - View Dependent Claims (8, 9, 10, 11)
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12. A method of increasing useable space within a housing of a device, the method comprising the steps of:
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adhering a conductive adhesive to the housing; and electrically connecting one or more electronic components with the conductive adhesive. - View Dependent Claims (13, 14, 15, 16)
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- 17. The method of claim 12, wherein the step of electrically connecting is performed by pressing the one or more electronic components into the conductive adhesive.
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17-1. A method of creating an electronic circuit on a non-conductive product, the method comprising the steps of:
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adhering a conductive adhesive to the non-conductive product; and electrically connecting one or more electronic components using the conductive adhesive.
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18-2. The method of claim 17, wherein the method further comprises the step of structurally supporting the one or more electronic components with the conductive adhesive.
Specification