NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME
First Claim
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1. A nitride semiconductor light emitting device comprising:
- a dielectric layered film over a substrate, the dielectric layered film being formed by stacking a plurality of dielectric films having different compositions;
a semiconductor thin film formed of a single crystal over the dielectric layered film; and
a pn junction diode structure over the semiconductor thin film, the pn junction diode structure being formed of a nitride semiconductor.
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Abstract
A nitride semiconductor light emitting device includes: a dielectric layered film over a substrate, the dielectric layered film being formed by stacking a plurality of dielectric films having different compositions; a semiconductor thin film formed of a single crystal over the dielectric layered film; and a pn junction diode structure over the semiconductor thin film, the pn junction diode structure being formed of a nitride semiconductor.
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Citations
26 Claims
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1. A nitride semiconductor light emitting device comprising:
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a dielectric layered film over a substrate, the dielectric layered film being formed by stacking a plurality of dielectric films having different compositions; a semiconductor thin film formed of a single crystal over the dielectric layered film; and a pn junction diode structure over the semiconductor thin film, the pn junction diode structure being formed of a nitride semiconductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method for fabricating a nitride semiconductor light emitting device comprising the steps of:
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(a) alternately stacking a plurality of dielectric films having different compositions over a substrate to form a dielectric layered film; (b) bonding a semiconductor thin film formed of a single crystal to the dielectric layered film; and (c) forming a pn junction diode structure formed of a nitride semiconductor over the semiconductor thin film. - View Dependent Claims (21, 22, 23, 24, 25, 26)
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Specification