Shallow trench isolation using atomic layer deposition during fabrication of a semiconductor device
First Claim
1. A method of semiconductor device fabrication, comprising:
- etching a trench within a semiconductor wafer substrate assembly;
forming a first dielectric comprising atomic layer deposition (ALD) silicon dioxide within the opening;
partially etching the ALD silicon dioxide from the trench so that a first portion of the trench is filled with the ALD silicon dioxide and a second portion of the trench is unfilled with the ALD silicon dioxide; and
forming a second dielectric comprising a material different from the first dielectric within the second portion of the trench.
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Accused Products
Abstract
A method for providing an isolation material, for example trench isolation for a semiconductor device, comprises forming a first dielectric such as silicon dioxide using an atomic layer deposition (ALD) process within a trench, partially etching the first dielectric, then forming a second dielectric such as a silicon dioxide using a high density plasma (HDP) deposition within the trench. The second dielectric provides desirable properties such as resistance to specific etches than the first dielectric, while the first dielectric fills high aspect ratio openings more easily than the second dielectric. Depositing the first dielectric results in a decreased trench aspect ratio which must be filled by the second dielectric.
397 Citations
24 Claims
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1. A method of semiconductor device fabrication, comprising:
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etching a trench within a semiconductor wafer substrate assembly; forming a first dielectric comprising atomic layer deposition (ALD) silicon dioxide within the opening; partially etching the ALD silicon dioxide from the trench so that a first portion of the trench is filled with the ALD silicon dioxide and a second portion of the trench is unfilled with the ALD silicon dioxide; and forming a second dielectric comprising a material different from the first dielectric within the second portion of the trench. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for forming a dielectric region for a semiconductor device, comprising:
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etching a semiconductor wafer substrate assembly to have an opening therein; forming a first dielectric within the opening using an atomic layer deposition (ALD) process such that the ALD dielectric fills a first part of the opening and leaves a second part of the opening unfilled; and forming a second dielectric different from the first dielectric to contact the first dielectric and to fill the second part of the opening. - View Dependent Claims (9, 10, 11, 12)
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13. A method of semiconductor device fabrication, comprising:
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etching a trench within a semiconductor wafer substrate assembly; forming an atomic layer deposition (ALD) dielectric within the trench using a process comprising; exposing the etched semiconductor wafer substrate assembly to a silicon-based compound and to at least one of a heterocyclic aromatic organic compound and a Lewis base;
thenexposing the etched semiconductor wafer substrate assembly to a compound containing oxygen and to at least one of a heterocyclic aromatic organic compound and a Lewis base; etching the ALD dielectric such that the ALD dielectric fills only a first portion of the trench to a and leaves a second portion of the trench unfilled by the ALD dielectric; and filling the second part of the trench using a dielectric different from the ALD dielectric. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A semiconductor device comprising:
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a trench formed within a semiconductor wafer substrate assembly; a first dielectric which fills a majority of the trench, wherein the first dielectric comprises atomic layer deposition (ALD) oxide; and a second dielectric different from the ALD oxide which fills a remainder of the trench. - View Dependent Claims (20, 21, 22)
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23. A method of semiconductor device fabrication, comprising:
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etching a shallow isolation trench within a semiconductor wafer substrate assembly; forming a first dielectric comprising tetraethyl orthosilicate (TEOS) within the opening using a chemical vapor deposition (CVD) process or a low-pressure CVD (LPCVD) process; partially etching the TEOS from the trench so that a first portion of the trench is filled with the TEOS and a second portion of the trench is unfilled with the TEOS; and forming a second dielectric comprising a material different from the first dielectric within the second portion of the trench to form shallow trench isolation within the semiconductor wafer substrate assembly. - View Dependent Claims (24)
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Specification