ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM
First Claim
Patent Images
1. An encapsulant cavity integrated circuit package system comprising:
- forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, the interposer having an integrated circuit electrically connected to and on a top thereof; and
attaching a component on the interposer in the encapsulant cavity.
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Abstract
An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
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Citations
20 Claims
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1. An encapsulant cavity integrated circuit package system comprising:
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forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, the interposer having an integrated circuit electrically connected to and on a top thereof; and attaching a component on the interposer in the encapsulant cavity. - View Dependent Claims (3, 4, 5)
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2. (canceled)
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6. An encapsulant cavity integrated circuit package system comprising:
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mounting a first integrated circuit package on a first surface of an interposer, the interposer having an integrated circuit electrically connected to and on a top thereof; molding a first encapsulant over the first integrated circuit forming a first integrated circuit package; mounting the first integrated circuit package with an inverted bottom terminal over a substrate; molding a second encapsulant over the first integrated circuit package with the inverted bottom terminal and the substrate forming an encapsulant cavity having a second surface of the interposer substantially exposed; and mounting a component on the second surface of the interposer in the encapsulant cavity. - View Dependent Claims (7, 8, 9, 10)
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11. An encapsulant cavity integrated circuit package system comprising:
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a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, the interposer having an integrated circuit electrically connected to and on a top thereof; and a component on the interposer in the encapsulant cavity. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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12. (canceled)
Specification