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ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM

  • US 20080179729A1
  • Filed: 03/27/2008
  • Published: 07/31/2008
  • Est. Priority Date: 03/31/2005
  • Status: Active Grant
First Claim
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1. An encapsulant cavity integrated circuit package system comprising:

  • forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, the interposer having an integrated circuit electrically connected to and on a top thereof; and

    attaching a component on the interposer in the encapsulant cavity.

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