Heat-sink module of light-emitting diode

• US 20080180015A1
• Filed: 01/29/2007
• Published: 07/31/2008
• Est. Priority Date: 01/29/2007
• Status: Abandoned Application

• Current Assignee: Unity OPTO Technology Company Limited
• Original Assignee: Unity OPTO Technology Company Limited
• Inventors: Wu, Ching-Huei, Kang, Yao-Jen
• Application Number:
  US11/699,247
• Publication Number:
  US 20080180015A1
• Time in Patent Office: Days
• US Class Current: 313/46
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis

Abstract

A heat-sink module of light-emitting diode comprises a circuit board, at least a light-emitting diode, at least a heat-conducting layer, and a heat-sink block, wherein the circuit board has a through hole formed thereon, and the light-emitting diode is mounted across over the through hole of the circuit board. In addition, the heat-conducting layer is mounted under the light-emitting diode. The heat-sink block is coupled with the heat-conducting layer via the through hole of the circuit board. As a result, the heat-dissipating efficiency of the light-emitting diode can be improved.

Claims

1. A heat-sink module of light-emitting diode comprising:

a circuit board having a through hole formed thereon;

at least a light-emitting diode mounted across over said through hole of said circuit board;

at least a heat-conducting layer mounted under said light-emitting diode; and

a heat-sink block coupled with said heat-conducting layer via said through hole of said circuit board so as to increase the heat-dissipating efficiency of said light-emitting diode.

2. A heat-sink module of light-emitting diode of claim 1, wherein said heat-conducting layer is a heat-sink plate.

3. A heat-sink module of light-emitting diode of claim 1, wherein said heat-conducting layer is a heat-sink paste.