RFID tag

• US 20080180255A1
• Filed: 01/25/2007
• Published: 07/31/2008
• Est. Priority Date: 01/25/2007
• Status: Abandoned Application

• Current Assignee: Avery Dennison Corporation
• Original Assignee: Avery Dennison Corporation
• Inventors: Isabell, Michael James
• Application Number:
  US11/657,721
• Publication Number:
  US 20080180255A1
• Time in Patent Office: Days
• US Class Current: 340/572.8
• CPC Class Codes: B31D 1/021 Making adhesive labels having a multilayered structure, e.g. provided on carrier webs
• CPC Class Codes: B31D 1/028 Applying RFID chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A method and system for making a label. The label can include a circuit disposed on a face of a substrate. The substrate may also contain printed indicia. The substrate may further be sealed using a laminate and an adhesive layer may be applied to a portion of the seal. The label may further include a release layer that covers the adhesive prior to adhering the label to a container.

Claims

1. A label, comprising:

a substrate having a first surface and a second surface, the first surface of the substrate having a circuit thereon;

a laminate disposed over the first surface and the second surface;

a layer of adhesive disposed over the laminate; and

a release layer covering the adhesive layer.

2. The label of claim 1, the circuit on the first surface further comprising:

an RFID inlay with at least one RFID microchip and at least one antenna.

3. The label of claim 2, wherein the RFID inlay is paper based.

4. The label of claim 1, further comprising:

a portion of the release layer having an opening to expose at least a portion of the circuit.

5. The label of claim 4, further comprising a portion of the laminate having an opening to expose at least a portion of the circuit.

6. The label of claim 1, further comprising:

an adhesive applied to an interior portion of the laminate.

7. The label of claim 1, wherein the laminate is polyethylene terephthalate (PET).

8. The label of claim 1, wherein the laminate extends beyond the edges of the label.

9. The label of claim 1, wherein the laminate acts to seal the label from outside elements.

10. The label of claim 1, wherein the laminate is transparent.

11. The label of claim 1, further comprising:

machine-readable indicia and human readable indicia printed of the second surface of the label.

12. The label of claim 10, wherein the machine-readable indicia is a barcode.

13. A method of making a label, comprising:

attaching a circuit to the first face of a substrate having a first face and a second face;

applying a laminate over the first face and the second face of the substrate;

applying an adhesive layer to the first face of the substrate; and

applying a release layer over the adhesive layer.

14. The method of claim 13, further comprising:

depositing and attaching at least one microchip to the circuit on the first substrate.

15. The method of claim 14, wherein the circuit is an antenna and the microchip is an RFID chip.

16. The method of claim 13, further comprising:

cutting a hole in the release layer, the adhesive layer and the laminate layer; and

positioning a microchip in contact with the circuit on the first face of the substrate.

17. The method of claim 13, further comprising:

disposing an adhesive on at least one interior surface of the laminating; and

adhering the laminate to the substrate.

18. The method of claim 13, wherein the laminate is polyethylene terephthalate (PET).

19. The method of claim 13, wherein the substrate is a paper-based RFID inlay.

20. The method of claim 19, further comprising:

printing the circuit on the RFID inlay using conductive ink.

21. The method of claim 19, further comprising:

printing machine-readable indicia and human-readable indicia on the RFID inlay.

22. The method of claim 13, further comprising:

sealing the RFID from outside elements with the laminate.

23. The method of claim 13, wherein the laminate is transparent.

24. A process for making an RFID label, comprising:

means to dispose a microchip and an antenna on the first surface of a substrate having a first surface and a second surface;

means to print indicia on the first surface of the substrate and the second surface of the substrate;

means to seal the substrate, the microchip, the antenna and the indicia from outside elements;

means to apply adhesive to the sealing means of the substrate located proximate the first surface of the substrate;

means to protectively cover the adhesive; and

means to remove the protective-covering means from the adhesive.

25. A label, comprising:

a paper-based substrate having a first surface and a second surface;

an antenna disposed on the first surface of the substrate by printing with conductive ink;

a microchip disposed proximate the antenna on the first surface of the substrate;

machine readable indicia and human readable indicia deposited on the second surface of the substrate by printing;

a seal disposed over the substrate by lamination of a polyethylene terephthalate;

an adhesive disposed over the seal and proximate the first surface of the substrate; and

a release layer disposed proximate the adhesive.