DROPLET DISCHARGING HEAD AND METHOD OF MANUFACTURING THE SAME, AND DROPLET DISCHARGING DEVICE AND METHOD OF MANUFACTURING THE SAME
First Claim
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1. A droplet discharging head, comprising:
- a cavity substrate including a discharge chamber having a bottom wall serving as a vibration plate; and
an electrode substrate including;
an individual electrode that faces the vibration plate with a gap and drives the vibration plate; and
a driver integrated circuit (IC) that couples with the individual electrode and applies a voltage to the individual electrode, wherein the cavity substrate includes;
a first opening that penetrates the cavity substrate and serves to house the driver IC; and
an insulation film formed on a wall face of the first opening.
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Abstract
A droplet discharging head comprises: a cavity substrate including a discharge chamber having a bottom wall serving as a vibration plate; and an electrode substrate including an individual electrode that faces the vibration plate with a gap and drives the vibration plate, and a driver integrated circuit (IC) that couples with the individual electrode and applies a voltage to the individual electrode. The cavity substrate includes a first opening that penetrates the cavity substrate and serves to house the driver IC, and an insulation film formed on a wall face of the first opening.
44 Citations
10 Claims
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1. A droplet discharging head, comprising:
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a cavity substrate including a discharge chamber having a bottom wall serving as a vibration plate; and an electrode substrate including; an individual electrode that faces the vibration plate with a gap and drives the vibration plate; and a driver integrated circuit (IC) that couples with the individual electrode and applies a voltage to the individual electrode, wherein the cavity substrate includes; a first opening that penetrates the cavity substrate and serves to house the driver IC; and an insulation film formed on a wall face of the first opening. - View Dependent Claims (2, 3, 4, 5)
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6. A method for manufacturing a droplet discharging head, comprising:
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forming a first recess and a second recess on a surface of a silicon substrate; forming an insulation film on the surface; anodic bonding the silicon substrate to an electrode substrate; and forming a liquid flow path to the silicon substrate, wherein the silicon substrate includes a discharge chamber having a bottom wall serving as a vibration plate and the liquid flow path communicating with the discharge chamber, and the electrode substrate includes an individual electrode that faces the vibration plate with a gap and drives the vibration plate, and the first recess that houses a driver integrated circuit (IC) that is mounted on the electrode substrate and couples to the individual electrode and supplies a voltage to the individual electrode, and the second recess corresponds to a flexible printed circuit (FPC) mount area that is formed on the electrode substrate and on which a flexible printed board is mounted to supply a signal for driving the individual electrode. - View Dependent Claims (7, 8, 9, 10)
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Specification