LIGHT EMITTING DEVICE

• US 20080180959A1
• Filed: 08/06/2007
• Published: 07/31/2008
• Est. Priority Date: 09/08/2006
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Nishiuchi, Naoki, Tokuda, Keisuke, KISHIKAWA, Daisuke
• Granted Patent: US 7,771,093 B2
• Time in Patent Office: Days
• US Class Current: 362/363
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01063 Europium [Eu]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device comprises a first metal member, a light emitting element mounted at one end of the first metal member, and a translucent covering material that covers at least the light emitting element, wherein the surface of the first metal member has a depression that determines the region where the translucent covering material is formed, and the inner wall of the depression is continuous.

Claims

1. A light emitting device, comprising a first metal member, a light emitting element mounted at one end of the first metal member, and a translucent covering material that covers at least the light emitting element,

wherein the surface of the first metal member has a depression that determines the region where the translucent covering material is formed, and

the inner wall of the depression is continuous.

2. The light emitting device according to claim 1, wherein the first metal member has a concave portion at one end, a light emitting element is housed in the concave portion, and the translucent covering material is disposed over the surface from the inside of the concave portion of the first metal member.

3. The light emitting device according to claim 1, wherein the shape of one end of the first metal member in plan view is similar to the shape of the adjacent concave portion, and the depression is disposed along the adjacent concave portion.

4. The light emitting device according to claim 3, wherein a plurality of the depressions are disposed along the adjacent concave portion.

5. The light emitting device according to claim 1, wherein the translucent covering material includes a fluorescent substance.

6. The light emitting device according to claim 1, wherein the first metal member has a protective element mounted at a location opposite the light emitting element, with the depression therebetween.