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METHOD OF FORMING A METAL LAYER OVER A PATTERNED DIELECTRIC BY ELECTROLESS DEPOSITION USING A SELECTIVELY PROVIDED ACTIVATION LAYER

  • US 20080182409A1
  • Filed: 07/25/2007
  • Published: 07/31/2008
  • Est. Priority Date: 01/31/2007
  • Status: Abandoned Application
First Claim
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1. A method, comprising:

  • providing an exposed surface of an activation layer selectively at a bottom of an opening formed in a material layer of a semiconductor device, said activation layer comprising a species for initiating an electrochemical deposition process when being in contact with a specified electrolyte solution; and

    applying said specified electrolyte solution in said opening to perform an electrochemical process for filling said opening with a conductive material from bottom to top on the basis of said exposed surface of the activation layer.

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