Electronic apparatus

• US 20080182539A1
• Filed: 09/21/2007
• Published: 07/31/2008
• Est. Priority Date: 01/25/2007
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Sato, Koichi, Tabata, Makoto, Tsujimura, Akihiro, Morimoto, Jun, Honda, Satoru, Honda, Tomoko, Kuroiwa, Nobuyoshi, Kato, Shoji, Nakahata, Masaomi, Sakurai, Minoru, Hata, Yoshikazu
• Granted Patent: US 8,812,062 B2
• Time in Patent Office: Days
• US Class Current: 455/269
• CPC Class Codes: H01Q 1/22 by structural association with other equipment or articles
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H05K 7/06 on insulating boards , e.g. wiring harnesses for printed circuits H05K1/18, H05K3/30

Abstract

An electronic apparatus includes: a first molded body; a second molded body which composes housing with the first molded body; a first conductive pattern provided in the housing; a second conductive pattern provided on an outer surface of the housing; and a first conductive member. The first conductive member passes through a gap of a mating face between the first molded body and the second molded body. The first conductive member connects the first conductive pattern and the second conductive pattern.

Claims

1. An electronic apparatus comprising:

a first molded body made of an insulator;

a second molded body made of an insulator and closed together with the first molded body;

a substrate provided with a first conductive pattern and fixed to the first molded body or the second molded body; and

a conductive member connecting the first conductive pattern and a second conductive pattern provided on an outer surface of at least one of the first and second molded bodies,

the conductive member being provided so as to pass through a gap of a mating face between the first molded body and the second molded body.

2. The electronic apparatus according to claim 1, wherein the conductive member is a conductive layer or a metal thin plate, the metal thin plate being formed on a film made of an insulator.

3. The electronic apparatus according to claim 1, wherein at least any one of the first and second conductive patterns is an antenna pattern.

4. The electronic apparatus according to claim 1, wherein one end of the conductive member is bonded to the second conductive pattern extending onto a concave portion formed on an outer surface of the first molded body or the second molded body, and a veneer is fit into the concave portion.

5. The electronic apparatus according to claim 1, wherein outer surfaces of the first molded body, the second molded body,

6. The electronic apparatus according to claim 1, wherein at least one of the first and second molded bodies have a cutout portion, the cutout portion being provided at the mating face, and the conductive member passes through the cutout portion.

7. The electronic apparatus according to claim 1, wherein the conductive member has an insulating film, a first conductive layer provided on one surface of the insulating film and a second conductive layer provided on other surface of the insulating film,

the first conductive layer connects the first conductive pattern and the second conductive pattern, and

the second conductive layer is connected to a ground.

8. An electronic apparatus comprising:

a first molded body made of an insulator;

a second molded body made of an insulator and closed together with the first molded body;

a substrate fixed to the first molded body or the second molded body; and

a conductive member connecting, in at least any one of the first and second molded bodies, a first conductive pattern provided on an inner surface thereof and a second conductive pattern, the second conductive pattern being provided on an outer surface thereof,

the conductive member being provided so as to pass through a gap of a mating face between the first molded body and the second molded body, and

the first conductive pattern being connected to an electric circuit provided on the substrate.

9. The electronic apparatus according to claim 8, wherein the conductive member is a conductive layer or a metal thin plate, the metal thin plate being formed on a film made of an insulator.

10. The electronic apparatus according to claim 8, wherein at least any one of the first and second conductive patterns is an antenna pattern.

11. The electronic apparatus according to claim 8, wherein one end of the conductive member is bonded to the second conductive pattern extending onto a concave portion formed on an outer surface of the first molded body or the second molded body, and a veneer is fit into the concave portion.

12. The electronic apparatus according to claim 11, wherein outer surfaces of the first molded body, the second molded body, and the veneer are covered with a coating film.

13. The electronic apparatus according to claim 8, wherein at least one of the first and second molded bodies have a cutout portion, the cutout portion being provided at the mating face, and the conductive member passes through the cutout portion.

14. The electronic apparatus according to claim 8, wherein

the conductive member has an insulating film, a first conductive layer provided on one surface of the insulating film and a second conductive layer provided on other surface of the insulating film,

the first conductive layer connects the first conductive pattern and the second conductive pattern, and

the second conductive layer is connected to a ground.

15. An electronic apparatus comprising:

a first molded body;

a second molded body, the second molded body composing housing with the first molded body;

a first conductive pattern provided in the housing;

a second conductive pattern provided on an outer surface of the housing; and

a first conductive member passing through a gap of a mating face between the first molded body and the second molded body, and connecting the first conductive pattern and the second conductive pattern.

16. The electronic apparatus according to claim 15, further comprising a third conductive pattern provided in the housing, wherein

at least one of the first and second conductive patterns is a first antenna pattern for a first frequency band, and

the third conductive pattern is a second antenna pattern for a second frequency band, the second frequency band being different from the first frequency band.

17. The electronic apparatus according to claim 15, further comprising:

a third conductive pattern provided in the housing;

a fourth conductive pattern provided on the outer surface of the housing; and

a second conductive member passing through a gap of the mating face between the first molded body and the second molded body, and connecting the third conductive pattern and the fourth conductive pattern, wherein

at least one of the first and second conductive patterns is a first antenna pattern for a first frequency band, and

at least one of the third and fourth conductive patterns is a second antenna pattern for a second frequency band, the second frequency band being different from the first frequency band.

18. The electronic apparatus according to claim 15, wherein at least one of the first and second molded bodies have a cutout portion, the cutout portion being provided at the mating face, and the first conductive member passes through the cutout portion.

19. The electronic apparatus according to claim 15, wherein

the first conductive member has a first insulating film, a first conductive layer provided on one surface of the first insulating film and a second conductive layer provided on other surface of the first insulating film,

the first conductive layer connects the first conductive pattern and the second conductive pattern, and

the second conductive layer is connected to a ground.

20. The electronic apparatus according to claim 17, wherein

the second conductive member has a second insulating film, a first conductive layer provided on one surface of the second insulating film and a second conductive layer provided on other surface of the second insulating film,

the third conductive layer connects the third conductive pattern and the fourth conductive pattern, and

the fourth conductive layer is connected to a ground.