ELECTRONIC PRODUCT AND TOUCHPAD STRUCTURE THEREOF AND METHOD FOR FORMING THE SAME

• US 20080185191A1
• Filed: 01/31/2008
• Published: 08/07/2008
• Est. Priority Date: 02/02/2007
• Status: Abandoned Application

• Current Assignee: Darfon Electronics Corporation
• Original Assignee: Darfon Electronics Corporation
• Inventors: Lin, Chih-Nan
• Application Number:
  US12/023,862
• Publication Number:
  US 20080185191A1
• Time in Patent Office: Days
• US Class Current: 178/18.03
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes

Abstract

A touchpad comprises a first insulating layer and a second insulating layer. The first insulating layer has a sensor surface and a plurality of metal sensors disposed on the sensor surface. The second insulating layer has a touch surface and a connecting surface. The connecting surface is opposite to the touch surface and covers the metal sensors. An electronic product comprises a main body and a touchpad. The main body has an exterior. The touchpad is disposed in the main body and exposed to the exterior of the main body. A method for forming a touchpad comprises locating a plurality of metal sensors on a sensor surface of a first insulating layer, and then connecting the first insulating layer and a second insulating layer, with the metal sensors sandwiched between the first insulating layer and the second insulating layer.

Claims

1. A touchpad comprising:

a first insulating layer having a sensor surface and a plurality of metal sensors disposed on the sensor surface; and

a second insulating layer having a touch surface and a connecting surface,

wherein the connecting surface is opposite to the touch surface and covers the metal sensors.

2. The touchpad as claimed in claim 1, wherein the first insulating layer and the second insulating layer are connected by laminating.

4. An electronic product comprising:

a main body having an exterior; and

a touchpad as claimed in claim 1, disposed in the main body and exposed to the exterior of the main body.

5. The electronic product as claimed in claim 4, wherein the electronic product comprises a notebook, a personal digital assistant, a global positioning system or a digital camera.

3. An touchpad comprising:

a first circuit board having a sensor surface and a plurality of metal sensors disposed on the sensor surface; and

a second circuit board having a touch surface and a connecting surface,

wherein the connecting surface is opposite to the touch surface and covers the metal sensors.

6. A method for forming a touchpad comprising:

locating a plurality of metal sensors on a sensor surface of a first insulating layer; and

connecting the first insulating layer and a second insulating layer, with the metal sensors sandwiched between the first insulating layer and the second insulating layer.

7. The method for forming the touchpad as claimed in claim 6, wherein the metal sensors are formed on the sensor surface by etching.

8. The method for forming the touchpad as claimed in claim 6, wherein the first insulating layer and the second insulating layer are connected by laminating.

9. A method for forming a touchpad comprising:

locating a plurality of metal sensors on a sensor surface of a first circuit board; and

connecting the first circuit board and a second circuit board, with the metal sensors sandwiched between the first circuit board and the second circuit board.

10. The method for forming the touchpad as claimed in claim 9, wherein the metal sensors are formed on the sensor surface by etching.

11. The method for forming the touchpad as claimed in claim 9, the first circuit board and the second circuit board are connected by laminating.