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Diimide-based semiconductor materials and methods of preparing and using the same

  • US 20080185577A1
  • Filed: 11/19/2007
  • Published: 08/07/2008
  • Est. Priority Date: 11/17/2006
  • Status: Active Grant
First Claim
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1. A compound having the formula:

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  • 5 Assignments
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