LIGHT-EMITTING MODULE

• US 20080185597A1
• Filed: 02/06/2007
• Published: 08/07/2008
• Est. Priority Date: 02/06/2007
• Status: Abandoned Application

• Current Assignee: Universal Scientific Industrial Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Universal Scientific Industrial Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: WU, Ming-Che
• Application Number:
  US11/671,566
• Publication Number:
  US 20080185597A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers

Abstract

A light-emitting module includes a base, a connecting unit disposed on the base, a light-emitting unit disposed on the base, and a drive unit electrically coupled to and bridging the connecting unit and the light-emitting unit for driving the light-emitting unit. The base includes a plurality of first bonding pads formed thereon. The connecting unit is electrically coupled to the first bonding pads, and the light-emitting unit is electrically coupled to the first bonding pads via the drive unit and the connecting unit. The connecting unit includes a plurality of connectors aligned in a first direction of the base, and the light-emitting unit includes a plurality of light-emitting elements aligned in the first direction and respectively spaced apart from and aligned with the connectors in a second direction perpendicular to the first direction.

Claims

1. A light-emitting module, comprising:

a base;

a connecting unit disposed on said base;

a light-emitting unit disposed on said base; and

a drive unit electrically coupled to and bridging said connecting unit and said light-emitting unit for driving said light-emitting unit.

2. The light-emitting module of claim 1, wherein said base includes a plurality of first bonding pads formed thereon, said connecting unit being electrically coupled to said first bonding pads, said light-emitting unit being electrically coupled to said first bonding pads via said drive unit and said connecting unit.

3. The light-emitting module of claim 2, wherein said connecting unit includes a plurality of connectors aligned in a first direction of said base, and said light-emitting unit includes a plurality of light-emitting elements aligned in the first direction and respectively spaced apart from and aligned with said connectors in a second direction perpendicular to the first direction.

4. The light-emitting module of claim 3, wherein said connecting unit further includes a plurality of connecting wires, and each of said connectors includes a plurality of conducting lines formed thereon and electrically coupled to said drive unit, said connecting wires electrically and respectively coupling said conducting lines of each of said connectors to corresponding ones of said first bonding pads of said base.

5. The light-emitting module of claim 4, wherein each of said light-emitting elements includes a plurality of light-emitting diode chips, each of which is electrically coupled to a respective one of said first bonding pads through said drive unit, a respective one of said connecting wires, and a respective one of said conducting lines.

6. The light-emitting module of claim 5, wherein said drive unit includes a plurality of drive elements aligned in the first direction, each of said drive elements bridging a corresponding one of said connectors and a corresponding one of said light-emitting elements.

7. The light-emitting module of claim 6, wherein each of said drive elements includes a flip chip surface facing the corresponding one of said connectors and the corresponding one of said light-emitting elements, and two rows of second bonding pads formed on said flip chip surface, one of the rows of said second bonding pads being electrically and respectively coupled to said first bonding pads respectively through said conducting lines and said connecting wires, and the other of the rows of said second bonding pads being electrically coupled to selected ones of said light-emitting diode chips of a respective one of said light-emitting elements.

8. The light-emitting module of claim 7, wherein said flip chip surface has edge portions extending in the first direction and opposite one another in the second direction, one of the rows of said second bonding pads being formed on one of said edge portions, the other of the rows of said second bonding pads being formed on the other of said edge portions.

9. The light-emitting module of claim 1, wherein said base is in the form of a printed circuit board.