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Miniaturized imaging device with integrated circuit connector system

  • US 20080185672A1
  • Filed: 03/27/2008
  • Published: 08/07/2008
  • Est. Priority Date: 03/18/2002
  • Status: Active Grant
First Claim
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1. A stacked, miniaturized imaging device, comprising:

  • a first layer comprising a substantially planar support member having at least two alignment apertures disposed on opposing sides thereof, the alignment apertures being oriented to position attached conductive wires approximately perpendicular to a top surface of the support member;

    a second layer disposed on top of the first layer and comprising a substantially planar SSID having at least one imaging array disposed thereon and associated conductive contact points thereon;

    a third layer comprising a lens adaptor disposed on top of the second layer, the lens adaptor being configured to house a cylindrical lens system therein and further comprising conductive contact points disposed on an outer side surface of the lens adaptor and continuously extending to a bottom surface of the lens adaptor; and

    at least one conductive wire disposed within each alignment aperture and positioned to align the three layers in a stacked configuration, the conductive wires extending longitudinally along a corresponding side surface of the second and third layers and contacting the conductive contact points disposed on the outer surface of the lens adaptor.

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