Microelectronic packages and methods therefor

• US 20080185705A1
• Filed: 08/23/2007
• Published: 08/07/2008
• Est. Priority Date: 12/23/2005
• Status: Abandoned Application

• Current Assignee: Tessera, Inc. (Adeia, Inc.)
• Original Assignee: Tessera, Inc. (Adeia, Inc.)
• Inventors: Beroz, Masud, Haba, Belgacem, Humpston, Giles, Kang, Teck-Gyu, Osborn, Philip R., Chau, Ellis, Park, Jae M., Crisp, Richard Dewitt, Thompson, Jesse Burl, Duong, Dat Nghe
• Application Number:
  US11/895,191
• Publication Number:
  US 20080185705A1
• Time in Patent Office: Days
• US Class Current: 257/690
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13169 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/1357 Single coating layer
• CPC Class Codes: H01L 2224/13582 Two-layer coating
• CPC Class Codes: H01L 2224/13644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 : being circular
• CPC Class Codes: H01L 2224/45099 : Material
• CPC Class Codes: H01L 2224/4824 : Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/73215 : Layer and wire connectors
• CPC Class Codes: H01L 2224/83194 : Lateral distribution of the layer connectors
• CPC Class Codes: H01L 2224/83365 : Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/83385 : Shape, e.g. interlocking features
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/4985 : Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/31 : Structure, shape, material or disposition of the layer connectors after the connecting process
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

A microelectronic package includes a microelectronic element having a first face including contacts, and a flexible substrate having a first surface and a second surface, conductive posts projecting from the first surface and conductive terminals accessible at the second surface, at least some of the conductive terminals and the conductive posts being electrically interconnected and at least some of the conductive terminals being offset from the conductive posts. The first surface of the flexible substrate is juxtaposed with the first face of the microelectronic element so that the conductive posts project from the flexible substrate toward the first face of the microelectronic element. The conductive posts are electrically interconnected with the contacts of the microelectronic element and at least some of the conductive terminals are movable relative to the microelectronic element.

Claims

1. A microelectronic package comprising:

a microelectronic element having a first face including contacts;

a flexible substrate having a first surface and a second surface, conductive posts projecting from said first surface and conductive terminals accessible at said second surface, at least some of said conductive terminals and said conductive posts being electrically interconnected and at least some of said conductive terminals being offset from said conductive posts;

said first surface of said flexible substrate being juxtaposed with said first face of said microelectronic element so that said conductive posts project from said flexible substrate toward said first face of said microelectronic element, wherein said conductive posts are electrically interconnected with said contacts of said microelectronic element and at least some of said conductive terminals are movable relative to said microelectronic element.

2. The package as claimed in claim 1, wherein said microelectronic element comprises a semiconductor chip.

3. The package as claimed in claim 1, wherein said microelectronic element comprises a semiconductor wafer.

4. The package as claimed in claim 1, wherein at least some of said conductive posts are in direct contact with at least some of said contacts on said microelectronic element.

5. The package as claimed in claim 1, further comprising a conductive material disposed between said conductive posts and said contacts of said microelectronic element.

6. The package as claimed in claim 1, wherein said conductive posts have an outer surface comprising a noble metal.

7. The package as claimed in claim 1, further comprising conductive traces provided on said flexible substrate, wherein said conductive traces electrically interconnect at least some of said conductive posts with at least some of said conductive terminals.

8. The package as claimed in claim 7, wherein said conductive traces extend along the first surface of said flexible substrate.

9. The package as claimed in claim 7, wherein said conductive traces extend along the second surface of said flexible substrate.

10. The package as claimed in claim 7, wherein said conductive traces extend between said first and second surfaces of said flexible substrate.

11. The package as claimed in claim 1, wherein said flexible substrate comprises a dielectric sheet.

12. The package as claimed in claim 1, further comprising a compliant material disposed between said flexible substrate and said microelectronic element.

13. The package as claimed in claim 1, wherein said conductive posts are disposed in an array so that said conductive posts define a plurality of zones of said flexible substrate, each such zone being bounded by a plurality of said conductive posts defining corners of such zone, different ones of said conductive terminals being disposed in different ones of said zones.

14. The microelectronic package as claimed in claim 12, wherein only one of said conductive terminals is disposed in each of said zones.

15. A microelectronic assembly comprising a package as claimed in claim 1 and a circuit panel having contact pads, said conductive terminals of said flexible substrate confronting said contact pads and being electrically connected thereto.

16. A microelectronic package comprising:

a microelectronic element having a front face with contacts;

a flexible substrate juxtaposed with said microelectronic element, said flexible substrate having a first surface facing said microelectronic element and a second surface facing away from said microelectronic element;

a plurality of conductive posts extending from said first surface of said flexible substrate and projecting toward said microelectronic element, said conductive posts being electrically connected to said contacts of said microelectronic element; and

said flexible substrate having conductive terminals accessible at said second surface thereof, said conductive terminals being electrically interconnected with said conductive posts, said flexible substrate being supported above said front face of said microelectronic element by said conductive posts so that said substrate is at least partially unconstrained in flexure, wherein said conductive terminals are movable relative to said microelectronic element.

17. The microelectronic package as claimed in claim 16, wherein at least some of said conductive posts are offset from said conductive terminals.

18. The microelectronic package as claimed in claim 16, further comprising electrically conductive traces on said flexible substrate, at least some of said conductive traces electrically interconnecting at least some of said posts to at least some of said terminals.

19. A microelectronic assembly comprising:

(a) a microelectronic package comprising;

a microelectronic element having a first face including contacts;

a flexible substrate having a first surface and a second surface, conductive posts projecting from said first surface and conductive terminals accessible at said second surface, said conductive posts and said conductive terminals being electrically interconnected and at least some of said conductive terminals being offset from said conductive posts;

said first surface of said flexible substrate being juxtaposed with said first face of said microelectronic element so that said conductive posts project from said flexible substrate toward said first face of said microelectronic element, wherein said conductive posts are electrically interconnected with said contacts of said microelectronic element and at least some of said conductive terminals are movable relative to said first face of said microelectronic element;

(b) a circuit panel having contact pads, said conductive terminals of said flexible substrate confronting said contact pads;

(c) a bonding material securing said conductive terminals of said flexible substrate to said contact pads, said bonding material extending between said conductive terminals and said pads.

20. The assembly as claimed in claim 19, wherein said flexible substrate is at least partially unconstrained in flexure, said conductive terminals being attached to said flexible substrate so that said conductive terminals can move relative to said microelectronic element upon flexure of said substrate.