LED Light in Sealed Fixture with Heat Transfer Agent

• US 20080186704A1
• Filed: 08/10/2007
• Published: 08/07/2008
• Est. Priority Date: 08/11/2006
• Status: Active Grant

• Current Assignee: Enertron, Inc.
• Original Assignee: Enertron, Inc.
• Inventors: Richardson, James, CHOU, Der Jeou
• Granted Patent: US 7,766,512 B2
• Time in Patent Office: Days
• US Class Current: 362/249
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/767 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 31/005 Sealing arrangements therefor
• CPC Class Codes: F21W 2131/401 for swimming pools
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

An LED light system has an LED light module for inserting into a standard fixture. The fixture has a housing and cover for sealing the enclosure. The LED module contains a shell or outer surface having a matching form factor as the housing for making physical contact with the housing over a sufficient surface area to provide good thermal contact. A substrate is mounted on a support structure. A plurality of LEDs is disposed on the substrate. A heat transfer agent or medium transfers heat from the LEDs to the housing. The outer surface of the LED module spreads the heat over its surface area and firmly contacts the surface of the housing for good thermal transfer. The heat transfer medium is made of a thermally conductive material such as aluminum or copper and formed to contact a surface area of the LED module.

Claims

1. An LED light system, comprising:

an enclosure having a housing with a form factor and cover for sealing the enclosure; and

an LED module for inserting into the enclosure, the LED module including,

(a) a shell having a matching form factor as the form factor of the housing for making physical contact with the housing over a surface area,

(b) a support structure,

(c) a substrate mounted on the support structure,

(d) a plurality of LEDs disposed on the substrate, and

(e) a heat transfer medium between the LEDs and the shell of the LED module.

2. The LED light system of claim 1, wherein the heat transfer medium is made of a thermally conductive material.

3. The LED light system of claim 2, wherein the thermally conductive material contains aluminum or copper.

4. The LED light system of claim 1, wherein the heat transfer medium includes heat pipes in contact with the support structure and formed to contact a surface area of the shell.

5. The LED light system of claim 1, wherein the LED light module further includes a power converter which receives an AC input voltage and provides a DC output voltage to the LEDs.

6. The LED light system of claim 1, wherein the LED light module further includes a push spring for asserting force against the shell.

7. The LED light system of claim 1, wherein the LED light module further includes a reflector ring surrounding the LEDs.

8. An LED light module, comprising:

an outer surface having a predetermined form factor;

a support structure;

a substrate mounted on the support structure;

a plurality of LEDs disposed on the substrate; and

a heat transfer medium between the LEDs and the outer surface of the LED light module.

9. The LED light module of claim 8, wherein the predetermined form factor of the outer surface of the LED light module is adapted for contacting a surface area of an enclosure.

10. The LED light module of claim 8, wherein the heat transfer medium is made of a thermally conductive material.

11. The LED light module of claim 10, wherein the thermally conductive material contains aluminum or copper.

12. The LED light module of claim 8, wherein the heat transfer medium includes heat pipes in contact with the support structure and formed to contact a surface area of the LED light module.

13. The LED light module of claim 8, further including a power converter which receives an AC input voltage and provides a DC output voltage to the LEDs.

14. The LED light module of claim 8, further including a push spring for asserting force against the outer surface of the LED light module.

15. The LED light module of claim 8, further including a reflector ring surrounding the LEDs.

16. A method of making an LED light module, comprising:

forming an outer surface having a predetermined form factor;

providing a support structure;

mounting a substrate on the support structure;

disposing a plurality of LEDs on the substrate; and

providing a heat transfer medium between the LEDs and the outer surface of the LED light module.

17. The method of claim 16, wherein the predetermined form factor of the outer surface of the LED light module is adapted for contacting a surface area of an enclosure.

18. The method of claim 16, wherein the heat transfer medium is made of a thermally conductive material.

19. The method of claim 18, wherein the thermally conductive material contains aluminum or copper.

20. The method of claim 16, further including forming heat pipes from the support structure to contact a surface area of the LED light module.

21. An LED light module, comprising:

an outer surface having a predetermined form factor;

a support structure;

an LED light engine mounted to the support structure; and

a heat transfer medium between the LEDs and the outer surface of the LED light module.

22. The LED light module of claim 21, wherein the LED light engine includes:

substrate mounted on the support structure; and

a plurality of LEDs disposed on the substrate.

23. The LED light module of claim 21, wherein the predetermined form factor of the outer surface of the LED light module is adapted for contacting a surface area of an enclosure.

24. The LED light module of claim 21, wherein the heat transfer medium is made of a thermally conductive material.

25. The LED light module of claim 24, wherein the thermally conductive material contains aluminum or copper.

26. The LED light module of claim 21, wherein the heat transfer medium includes heat pipes in contact with the support structure and formed to contact a surface area of the LED light module.

27. The LED light module of claim 21, further including a push spring for asserting force against the outer surface of the LED light module.