METHOD OF MANUFACTURING DISPLAY SUBSTRATE, METHOD OF PATTERNING INORGANIC LAYER AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME

• US 20080188023A1
• Filed: 12/03/2007
• Published: 08/07/2008
• Est. Priority Date: 02/05/2007
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Shin, Yong-Hwan, Rho, Soon-Joon, Jeon, Baek-Kyun
• Granted Patent: US 7,781,243 B2
• Time in Patent Office: Days
• US Class Current: 438/30
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1288 employing particular masking sequences or specially adapted masks, e.g. half-tone mask
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence

Abstract

A method of manufacturing a display substrate includes forming a plurality of thin film transistors (TFTs) on a first substrate in a matrix, forming a plurality of pixel electrodes connected to the TFTs, forming a connecting pad to receive a common voltage, forming an organic pattern on the connecting pad, depositing an inorganic alignment layer covering the organic pattern on the first substrate, and removing the organic pattern and the inorganic alignment layer remaining on the organic pattern.

Claims

1. A method of manufacturing a display substrate, the method comprising:

forming a plurality of thin film transistors (TFTs) on a first substrate in a matrix;

forming a plurality of pixel electrodes connected to the TFTs, and a connecting pad to receive a common voltage;

forming an organic pattern on the connecting pad;

depositing an inorganic alignment layer covering the organic pattern on the first substrate; and

removing the organic pattern and the inorganic alignment layer remaining on the organic pattern.

2. The method of claim 1, further comprising:

forming transmission lines to transmit driving signals to the TFTs, a plurality of transmission pads disposed at a terminal portion of the transmission lines, and a common voltage pad electrically connected to the connecting pads.

3. The method of claim 1, wherein forming the organic pattern comprises:

forming a seal coat to cover the connecting pads and the common voltage pad; and

forming a short point to cover the connecting pads.

4. The method of claim 2, wherein the connecting pads comprise a plurality of gate transmission pads and a plurality of data transmission pads, and wherein the gate transmission pads comprise a layer different from a layer of the data transmission layer.

5. The method of claim 4, wherein the common voltage pad comprises the same as or substantially the same layer as a layer of the data transmission pads.

6. The method of claim 5, further comprising:

forming a common electrode on a second substrate;

forming an organic pattern on the common electrode;

depositing an inorganic alignment layer on the common electrode covering the organic pattern; and

removing the organic pattern and the organic alignment layer remaining on the organic pattern.

7. The method of claim 6, wherein removing the organic pattern comprises forming a contact hole in the inorganic alignment layer to partially expose the common electrode.

8. A method of patterning an inorganic layer, the method comprising:

forming an organic material to form an organic pattern on a first substrate;

depositing an inorganic layer on the first substrate to cover the organic pattern; and

removing the inorganic layer remaining on the organic pattern.

9. The method of claim 8, wherein the organic pattern comprises a photoresist.

10. The method of claim 9, wherein the organic pattern is removed using a developing agent.

11. The method of claim 8, wherein the organic pattern comprises a water-soluble synthetic resin.

12. The method of claim 11, wherein the water-soluble synthetic resin comprises PVA, polyacryamide, a methylol urea resin, a methylol melamine resin, and carboxymethylcellulose CMC.

13. The method of claim 12, wherein the organic pattern is removed using at least one of ultra pure water or deionized water.

14. The method of claim 8, wherein the organic material is dropped on the first substrate through a nozzle.

15. The method of claim 8, wherein the inorganic material comprises an alignment layer.

16. The method of claim 15, wherein the inorganic material comprises silicon oxide.

17. The method of claim 16, wherein a height of the organic pattern is higher than a thickness of the inorganic material by more than about 1000 times.

18. A method of manufacturing a display device, the method comprising:

forming a connecting pad on a first substrate to apply a common voltage;

forming a lower organic pattern on the connecting pad;

depositing a lower alignment layer on the first substrate covering the lower organic pattern;

removing the lower organic pattern partially exposing the common electrode;

forming a common electrode on a second substrate and an upper alignment layer on the common electrode, wherein the upper alignment layer includes a contact hole partially exposing the common electrode;

forming a sealant interposed between the lower alignment layer and the upper alignment layer;

forming a connecting spacer between the connecting pad and the common electrode electrically connecting the connecting pad and the common electrode through the contact hole; and

forming a liquid crystal layer between the lower alignment layer and the upper alignment layer, wherein the liquid crystal layer is sealed by the sealant.

19. The method of claim 18, wherein forming the connecting pad comprises:

forming a TFT on a first substrate;

forming a pixel electrode connected to the TFT;

forming a transmission line to transmit a driving signal to the TFT, and a transmission pad connected to a terminal portion of the transmission line.