PACKAGING FOR LOW-COST, HIGH-PERFORMANCE MIRCOWAVE AND MILLIMETER WAVE MODULES

• US 20080188098A1
• Filed: 02/02/2007
• Published: 08/07/2008
• Est. Priority Date: 02/02/2007
• Status: Active Grant

• Current Assignee: Harris Stratex Networks Operating Corporation (Aviat Networks Incorporated)
• Original Assignee: Harris Stratex Networks, Inc.
• Inventors: Nealis, Edwin John, Boesch, Ronald D., Nicolae, Costel
• Granted Patent: US 8,395,256 B2
• Time in Patent Office: Days
• US Class Current: 439/74
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 13/04 Mounting of components , e.g. of leadless components
• CPC Class Codes: H05K 9/0056 specially adapted for microwave applications
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

Microwave or millimeter wave module packaging having a module with a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a first side thereof and operatively connected to the components, and a second connector attached to a second side thereof and operatively connected to the components through the board. The cover and baseplate form a cavity containing the board and components, and the second connector may be operatively connected to a third connector such as a printed circuit board disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operatively connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.

Claims

1. A module comprising:

a baseplate having a microwave or millimeter wave component attached thereto;

a substantially planar transition board having a first connector attached to a first side of said board and operatively connected to said component and a second connector attached to a second side of said board and operatively connected to said component through said board; and

a cover;

wherein said cover and said baseplate form a cavity containing said board and said component, and

wherein said second connector is operatively connected to a third connector disposed outside of said cavity.

2. The module of claim 1 wherein said component is selected from the group consisting of:

monolithic microwave integrated circuit chips, field effect transistors, transistors, diodes, mixers, multipliers, modulators, amplifiers, attenuators, switches, circulators, isolators, filters, couplers, detectors, splitters, combiners, substrates, or combinations thereof.

3. The module of claim 1 wherein connection between said second and third connectors is a blind mate connection.

4. The module of claim 1 wherein said board is removably attached to said baseplate.

5. The module of claim 1 wherein connection between first connector and component is a direct connection without a wire or cable.

6. The module of claim 1 wherein power and signal connectors are not attached to either said baseplate or said cover.

7. The module of claim 1 wherein said baseplate and said cover do not provide electromagnetic interference protection.

8. The module of claim 1 wherein said transition board further includes a fourth connector attached to another side of said board, said fourth connector operatively connected to said component through said transition board.

9. The module of claim 1 wherein said transition board further includes a fourth connector attached to another side of said board, said fourth connector directly connected to said component.

10. An assembly comprising;

a structure having an Indentation for accepting a module, said indentation bounded on one side by a printed circuit board;

said module comprising;

a baseplate having a microwave or millimeter wave component attached thereto;

a substantially planar transition board having a first connector attached to a first side of said board and operatively connected to said component and a second connector attached to a second side of said board and operatively connected to said component through said board; and

a first cover wherein said first cover and said baseplate form a cavity containing said board and said component; and

a second cover,

wherein said module is disposed within said indentation such that said second connector is operatively connected to said printed circuit board, and

wherein said second cover and said structure enclose said module.

11. The assembly of claim 10 wherein said component is selected from the group consisting of:

monolithic microwave integrated circuit chips, field, effect transistors, transistors, diodes, mixers, multipliers, modulators, amplifiers, attenuators, switches, circulators, isolators, filters, couplers, detectors, splitters, combiners, substrates, or combinations thereof.

12. The assembly of claim 10 wherein connection between said second connector and said printed circuit board is a blind mate connection.

13. The assembly of claim 10 wherein said board is removably attached to said baseplate.

14. The assembly of claim 10 wherein said second cover and said structure enclose said module so as to provide electromagnetic interference protection.

15. The assembly of claim 10 wherein connection between first connector and component is a direct connection without a wire or cable.

16. The assembly of claim 10 wherein power and signal connectors are not attached to either said baseplate or said cover.

17. The assembly of claim 10 wherein said baseplate and said cover do not provide electromagnetic interference protection.

18. The assembly of claim 10 wherein said structure provides a second structure to remove heat from said module.

19. The assembly of claim 18 wherein said second structure is selected from the group consisting of:

heat fins, fan, heat pipes.

20. The assembly of claim 10 wherein said transition board further includes a fourth connector attached to another side of said board, said fourth connector operatively connected to said component through said transition board.

21. The assembly of claim 10 wherein said transition board further includes a fourth connector attached to a side of said board, said fourth connector directly connected to said component.

22. The assembly of claim 10 wherein said second cover and said indentation provide electromagnetic interference protection.

23. The assembly of claim 10 further comprising a gasket which provides electromagnetic interference protection.

24. A communication system operating in a predetermined frequency range comprising:

a plurality of assemblies, at least one assembly comprising;

a structure having an indentation for accepting a module, said indentation bounded on one side by a printed circuit board;

said module comprising;

a baseplate having a microwave or millimeter wave component attached thereto;

a substantially planar transition board having a first connector attached to a first side of said board and operatively connected to said component, and a second connector attached to a second side of said board and operatively connected to said component through said board; and

a first cover wherein said first cover and said baseplate form a cavity containing said hoard and said component; and

a second cover,

wherein said module is disposed within said indentation such that said second connector is operatively connected to said printed circuit board, and

wherein said second cover and said structure enclose said module.

25. The system of claim 24 wherein said component is selected from the group consisting of:

monolithic microwave integrated circuit chips, field effect transistors, transistors, diodes, mixers, multipliers, modulators, amplifiers, attenuators, switches, circulators, isolators, filters, couplers, detectors, splitters, combiners, substrates, or combinations thereof.

26. The system of claim 24 wherein connection between said second connector and said printed circuit board is a blind mate connection.

27. The system of claim 24 wherein said board is removably attached to said baseplate.

28. The system of claim 24 wherein said second cover and said structure enclose said module so as to provide electromagnetic interference protection.

29. The system of claim 24 wherein connection between first connector and component is a direct connection without a wire or cable.

30. The system of claim 24 wherein power and signal connectors are not attached to either said baseplate or said cover.

31. The system of claim 24 wherein said baseplate and said cover do not provide electromagnetic interference protection.

32. The system of claim 24 wherein said structure provides a second structure to remove heat from said module.

33. The system of claim 32 wherein said second structure is selected from the group consisting of;

heat fins, fan, heat pipes.

34. The system of claim 24 wherein said transition board further includes a fourth connector attached to another side of said board, said fourth connector operatively connected to said component through said transition board.

35. The system of claim 24 wherein said transition board further includes a fourth connector attached to another side of said board, said fourth connector directly connected to said component.

36. The system of claim 24 wherein said second cover and said indentation provide electromagnetic interference protection.

37. The system of claim 24 wherein said structure further comprises a gasket which provides electromagnetic interference protection.

38. A method for eliminating feed-throughs in an assembly comprising the steps of;

providing a structure having an indentation for accepting a module, said indentation bounded on one side by a printed circuit board;

operatively connecting a module to the printed circuit board, the module comprising;

a baseplate having a microwave or millimeter wave component attached thereto;

a substantially planar transition board having a first connector attached to a first side of said board and operatively connected to said component, and a second connector attached to a second side of said board and operatively connected to said component through said board, said connectors providing a direct connection without a wire or cable; and

a first cover wherein said first cover and said baseplate form a cavity containing said board and said component; and

removably attaching a second cover to the structure to enclose the module,

wherein power and signal connectors to the module are not attached to either the baseplate or the cover.

39. The method of claim 38 wherein the component is selected from the group consisting of:

monolithic microwave integrated circuit chips, field effect transistors, transistors, diodes, mixers, multipliers, modulators, amplifiers, attenuators, switches, circulators, isolators, filters, couplers, detectors, splitters, combiners, substrates, or combinations thereof.

40. The method of claim 38 wherein connection between said second connector and said printed circuit board is a blind mate connection.

41. The method of claim 38 wherein the step of removably attaching a second cover further comprises providing electromagnetic Interference protection.

42. The method of claim 38 wherein the step of operatively connecting a module to the printed circuit board further comprises transferring heat generated from the component to the structure.