Ultrasound Transducer Assembly Having Improved Thermal Management

• US 20080188755A1
• Filed: 04/20/2006
• Published: 08/07/2008
• Est. Priority Date: 04/25/2005
• Status: Abandoned Application

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Hart, Jeffrey
• Application Number:
  US11/912,617
• Publication Number:
  US 20080188755A1
• Time in Patent Office: Days
• US Class Current: 600/459
• CPC Class Codes: A61B 8/00 Diagnosis using ultrasonic, sonic or infrasonic waves imaging of objects using sonar G01S15/00
• CPC Class Codes: A61B 8/4472 Wireless probes
• CPC Class Codes: A61B 8/546 involving monitoring or regulation of device temperature
• CPC Class Codes: G10K 11/004 Mounting transducers, e.g. provided with mechanical moving or orienting device mountings specially adapted to a particular sound-producing device, see the preceding groups G10K1/00 - G10K9/00, e.g. G10K1/26, G10K1/28, G10K9/22; arrangements of sonic watch equipment on submarines B63G8/39; buoys B63B22/00

Abstract

An improved thermal management of an ultrasound transducer assembly is provided. The ultrasound transducer assembly includes an ultrasound transducer operable to transmit ultrasound energy along a propagation path; and a self-contained cooling system thermally coupling the ultrasound transducer to at least one heat sink. The self-contained cooling system includes at least one heat transfer member. The self-contained cooling system defines a heat flow from the ultrasound transducer assembly to the heat sink via the at least one heat transfer member. The propagation path of the ultrasound energy is opposite in direction to the heat flow path. The heat transfer process is augmented by the addition of a thermoelectric cooler positioned in thermal communication with the ultrasound transducer assembly. The self-contained cooling system provides for minimum thermal resistance, while the thermoelectric cooler maintains the heat flow in a positive direction and maintains positive thermal gradients thus enhancing the heat flow to the heat sink.

Claims

1. An ultrasound transducer assembly comprising:

an ultrasound transducer operable to transmit ultrasound energy along a propagation path, said ultrasound transducer comprising a transducer array and corresponding electrical circuitry in operative communication with said transducer array; and

a self-contained cooling system thermally coupling at least one of said transducer array and said corresponding electrical circuitry to at least one heat sink, said self-contained cooling system including at least one heat transfer member, wherein the self-contained cooling system defines a heat flow path from at least one of the transducer array and corresponding electrical circuitry to the at least one heat sink via the at least one heat transfer member, said propagation path of said ultrasound energy is substantially opposite in direction to said heat flow path.

2. The ultrasound transducer of claim 1, further comprising a thermoelectric cooler thermally coupled with at least one source, transducer array 104 or electrical circuitry 106.

3. The ultrasound transducer of claim 1, wherein said at least one heat transfer member includes a first element positioned between said transducer array and said corresponding electrical circuitry, and a second element positioned between the corresponding electrical circuitry and the at least one heat sink.

4. The ultrasound transducer of claim 1, wherein a central axis of the at least one heat transfer member is substantially aligned with a central axis of the at least one heat sink.

5. The ultrasound transducer of claim 1, wherein the at least one heat sink includes at least a portion of a cable assembly.

6. The ultrasound transducer of claim 1, further comprising a housing encasing said self-contained cooling system, wherein the at least one heat sink is the housing.

7. The ultrasound transducer of claim 6, wherein the at least one heat sink includes the housing and a cable assembly.

8. The ultrasound transducer of claim 1, wherein the at least one heat transfer member is partially filled with said working fluid.

9. The ultrasound transducer of claim 1, wherein the at least one heat transfer member is thermally coupled to the transducer array and extends through a portion of said at least one heat sink.

10. The ultrasound transducer of claim 1, wherein said transducer array is located in close proximity to said corresponding electrical circuitry.

11. The ultrasound transducer of claim 1, wherein the at least one heat sink is constructed from a thermally conductive polymer.

12. The ultrasound transducer of claim 1, wherein the cooling fluid includes a combination of liquid and gas phases.

13. An ultrasound transducer assembly comprising:

at least one thermally conductive heat sink;

a transducer mounted in operative communication with the at least one thermally conductive heat sink, the transducer operable to transmit ultrasound energy along a propagation path, said transducer comprising a transducer array and corresponding electrical circuitry coupled to said transducer array;

a self-contained cooling system in thermal communication with the transducer for conducting heat generated by the transducer array and corresponding electrical circuitry to said at least one heat sink, wherein said self-contained cooling system defines a heat flow from the transducer array and corresponding electrical circuitry to said at least one heat sink via at least one heat transfer member, wherein said propagation path and the heat flow being in opposite directional path.

14. The ultrasound transducer of claim 13, further comprising a thermoelectric cooler thermally coupled with said corresponding transducer array 104 or electrical circuitry 106.

15. The ultrasound transducer of claim 13, wherein the thermoelectric cooler is mounted adjacent to the electrical circuitry.

16. The ultrasound transducer of claim 13, wherein the self-contained cooling element extends into the at least one heat sink.

17. The ultrasound transducer of claim 13, wherein the at least one heat transfer member is partially filled with said working fluid.

18. The ultrasound transducer of claim 13, wherein the at least one heat sink is constructed from a thermally conductive material, said thermally conductive material is selected from a group consisting of thermally conductive polymer and metal.

19. A method of dissipating thermal energy generated by an ultrasound transducer assembly, comprising the steps of:

providing an ultrasound transducer assembly; and

providing a self-contained cooling system within said ultrasound transducer assembly thermally coupling at least one of an ultrasound transducer array and corresponding electrical circuitry of said ultrasound transducer array to at least one heat sink, said self-contained cooling system including at least one heat transfer member filled with a working fluid, defining a heat flow path of heat from at least one of the transducer array and corresponding electrical circuitry to the at least one heat sink via the at least one reservoir, and

enabling said thermal energy to propagate along said heat flow path during operation of said ultrasound transducer assembly, wherein said heat flow path propagates said thermal energy in a direction opposite an ultrasound propagation path of said ultrasound transducer assembly.

20. The method of claim 19, further comprising the step of providing a thermoelectric cooler thermally coupled with said ultrasound transducer.