High quality factor resonators for liquid immersion biological and chemical sensors

• US 20080190181A1
• Filed: 02/11/2008
• Published: 08/14/2008
• Est. Priority Date: 02/12/2007
• Status: Active Grant

• Current Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Original Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Inventors: Khuri-Yakub, Butrus T., Yaralioglu, Goksen G.
• Granted Patent: US 7,694,552 B2
• Time in Patent Office: Days
• US Class Current: 73/64.53
• CPC Class Codes: G01N 2291/014 Resonance or resonant frequency
• CPC Class Codes: G01N 2291/02466 Biological material, e.g. blood
• CPC Class Codes: G01N 29/022 Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices microdevices per se B81B

Abstract

A mechanical resonator capable of providing an intrinsically high mechanical quality factor in immersion is provided. The resonator includes a membrane attached at its perimeter to a frame, such that a front side of the membrane is in contact with the liquid, and the back side of the membrane is not in contact with the liquid or the frame. The membrane can act as a mechanical resonator. The quality factor of this resonator is enhanced by providing a pressure release boundary region on the frame in proximity to the membrane and in contact with the liquid. The pressure release boundary region provides a soft boundary condition, in the sense that a mechanical impedance on the solid side of the solid-liquid interface is less than the liquid mechanical impedance. Providing such a soft boundary condition reduces the mechanical energy loss due to excitation of waves in the liquid, thereby improving resonator quality factor. Such high-Q resonators are particularly useful for sensor applications.

Claims

1. A sensor subassembly for use in fluid immersion applications, the sensor subassembly comprising:

one or more membranes, each said membrane having a sensor surface and a back surface facing away from said sensor surface, wherein each said sensor surface is in contact with a fluid during operation of said sensor subassembly, and wherein each said back surface is not in contact with said fluid during operation of said sensor subassembly;

a frame around said one or more membranes and attached to perimeters of said one or more membranes, whereby each of said one or more membranes can act as a mechanical resonator during operation of said sensor subassembly;

one or more pressure-release boundary regions, disposed on said frame in proximity to said one or more membranes and in contact with said fluid during operation of said sensor subassembly;

wherein said pressure-release boundary regions have a smaller mechanical impedance than said fluid at interfaces between said pressure-release boundary regions and said fluid.

2. The sensor subassembly of claim 1, wherein said one or more pressure-release boundary regions each comprise one or more layers of solid material disposed on said frame.

3. The sensor subassembly of claim 1, wherein said one or more pressure-release boundary regions comprise an annular secondary membrane surrounding said one or more membranes, wherein said secondary membrane has a front surface in contact with said fluid during operation of said sensor subassembly and a back surface facing away from said front surface, wherein said back surface is not in contact with said fluid or with said frame during operation of said sensor subassembly.

4. The sensor subassembly of claim 1, wherein said one or more pressure-release boundary regions comprise one or more passive mechanical resonators, each of said passive mechanical resonators having substantially the same mechanical resonant frequency as said membrane.

5. The sensor subassembly of claim 4, wherein said one or more passive resonators are in the form of distinct annular rings centered on said one or more membranes.

6. The sensor subassembly of claim 4, wherein said passive resonators are arranged as a two-dimensional array centered substantially on said one or more membranes.

7. The sensor subassembly of claim 4, wherein said passive resonators are arranged as a one-dimensional array centered substantially on said one or more membranes.

8. The sensor subassembly of claim 4, wherein one or more of said passive resonators has a mechanical resonant frequency that can be tuned by application of a DC voltage.

9. The sensor subassembly of claim 4, wherein said passive mechanical resonators are mechanically coupled to act as coupled mechanical resonators.

10. The sensor subassembly of claim 1, wherein said fluid comprises a liquid.

11. The sensor subassembly of claim 1, wherein said one or more membranes are mechanically coupled to act as coupled mechanical resonators.

12. The sensor subassembly of claim 1, wherein said pressure-release boundary regions have a smaller mechanical impedance than said fluid at a resonant frequency of said one or more membranes.

13. A sensor comprising:

a sensor subassembly according to claim 1;

an energizing circuit providing power to drive mechanical oscillation of said one or more membranes; and

a sensing circuit providing a measurement of a resonant frequency of said one or more membranes.

14. The sensor of claim 13, wherein said sensor surfaces are treated to be capable of binding one or more analyte species that may be present in said fluid.

15. The sensor of claim 14, wherein said measurement of said resonant frequency of said one or more membranes is responsive to the presence of bound analytes on said sensor surfaces by way of a shift of said resonant frequency due to the mass of analytes bound to said sensor surfaces.

16. The sensor of claim 13, wherein said sensing circuit provides said measurement of a resonant frequency of said membrane by measuring a displacement of said one or more membranes.

17. The sensor of claim 16, wherein said displacement of said one or more membranes is measured according to a technique selected from the group consisting of:

atomic tip displacement sensing, optical displacement sensing, piezoelectric displacement sensing, and magnetic displacement sensing.