System For Delivery Of Reagents From Solid Sources Thereof

• US 20080191153A1
• Filed: 03/09/2006
• Published: 08/14/2008
• Est. Priority Date: 03/16/2005
• Status: Abandoned Application

• Current Assignee: Advanced Technology Materials, Inc. (Entegris Incorporated)
• Original Assignee: Advanced Technology Materials, Inc. (Entegris Incorporated)
• Inventors: Marganski, Paul J., Sweeney, Joseph D., Dietz, James
• Application Number:
  US11/908,964
• Publication Number:
  US 20080191153A1
• Time in Patent Office: Days
• US Class Current: 250/492.21
• CPC Class Codes: B01J 2219/00094 Jackets
• CPC Class Codes: B01J 2219/00141 Microwaves
• CPC Class Codes: B01J 2219/00146 Infrared radiation
• CPC Class Codes: B01J 7/00 Apparatus for generating gases production of inert gas mixtures B01J19/14; for generating specific gases, see the relevant subclasses, e.g. C01B, C10J ; in "air bags" on vehicles B60R21/26; for starter gas F02C7/26; blasting cartridges for producing gas under pressure F42B3/04
• CPC Class Codes: C23C 14/48 Ion implantation
• CPC Class Codes: C23C 14/564 Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• CPC Class Codes: C23C 16/4405 Cleaning of reactor or parts inside the reactor by using reactive gases
• CPC Class Codes: C23C 16/4481 by evaporation using carrier gas in contact with the source material C23C16/4486 takes precedence

Abstract

A system (10) for delivery of reagent from a solid source thereof, comprising a structure (16, 22, 24) arranged to retain a solid source material (30) in confinement by at least a portion of the structure, for heating and generation of vapor from the solid source material by volatilization thereof, a heat source (82) arranged to heat the solid source material for such volatilization, and a vapor dispensing assembly (52, 54) arranged to discharge the vapor from the system. A high conductance valve (1510) is also described, suitable for use as a dispensing control valve for a reagent storage and dispensing vessel, e.g., a vessel containing a semiconductor manufacturing reagent that is dispensed at low pressure. The high conductance valve includes a valve body (1512) in which inlet and outlet passages are substantially perpendicular to one another, with their interior extremities communicating with a valve chamber (1536) containing a selectively positionable valve element movable between a fully open and fully closed position. Valve flow coefficient (C_V) values on the order of 2.7 to 2.9 are achievable by such high conductance valve, enabling the valve to achieve superior dispensing operation even in extremely low pressure regimes, e.g., below 20 torr.

Claims

1-341. -341. (canceled)

342. A system for processing a semiconductor device, comprising:

a materials delivery system including a reagent supply vessel containing a source material utilized in processing the semiconductor device, and an added surface area structure in an interior volume of the reagent supply vessel for supporting the source material substantially disposed within interior regions of the added surface area structure;

wherein the reagent supply vessel is adapted to deliver a process effective amount of the source material to a processing apparatus in selective fluid communication with the reagent supply vessel and operable to perform one of ion implantation, chemical vapor deposition, etching, cleaning and a combination thereof.

343. The system of claim 342, wherein said source material comprises xenon difluoride.

344. The system of claim 342, wherein said added surface area structure comprises a metal foam body.

345. The system of claim 344, wherein said metal foam body comprises a metal selected from among aluminum and aluminum alloys.

346. The system of claim 344, wherein said reagent supply vessel is of cylindrical shape, and said metal foam body comprises an aluminum foam body of cylindrical shape disposed in said interior volume of the reagent supply vessel as a press-fit insert therein, with a solid fluorine chemistry source material disposed in porosity of said metal foam body.

347. An ion implant system, comprising:

(a) an ion implanter, including a gas box adapted to hold reagent supply vessels, wherein said ion implanter in operation becomes contaminated and requires cleaning to maintain its performance; and

(b) a source of XeF₂ chemistry comprising a solid source reagent supply vessel in said gas box, said reagent supply vessel including an internal volume containing solid XeF₂ and being adapted to deliver XeF₂ vapor from said solid XeF₂ in said reagent supply vessel to the ion implanter for cleaning thereof, said reagent supply vessel containing an added surface area structure in the interior volume for supporting said solid XeF₂.

348. The ion implant system of claim 347, wherein said added surface area structure in the interior volume of said reagent supply vessel comprises at least one structure selected from among metal foam, metal wool, metal spheres, stacked tray arrays, metal cubes, metal cylinders, and metal geometric shaped articles.

349. The ion implant system of claim 347, wherein said added surface area structure in the interior volume of said reagent supply vessel comprises a metal foam.

350. The ion implant system of claim 347, wherein said added surface area structure in the interior volume of said reagent supply vessel comprises a metal foam body of elongate cylindrical form, wherein the metal foam body is in press-fit contact with the reagent supply vessel along the entire length of the metal foam body in the interior volume of the reagent supply vessel.

351. The ion implant system of claim 347, wherein said added surface area structure in the interior volume of said reagent supply vessel comprises a porous material with a three-dimensional network of porosity, and said solid XeF₂ in particulate form is dispersed within said three-dimensional network of porosity in said porous material.

352. The ion implanter system of claim 351, wherein said porous material comprises a press-fit body in contact with interior surface of the vessel in the internal volume thereof.

353. A fluorine chemistry source for cleaning of an ion implanter, said source comprising a solid source reagent supply vessel including an internal volume, and a metal foam body for holding solid fluorine source material, said metal foam body contacting interior wall surface of said internal volume, whereby the metal foam transmits heat to said solid fluorine source material for sublimation thereof.

354. The fluorine chemistry source of claim 353, wherein said metal foam body comprises an aluminum foam body.

355. The fluorine chemistry source of claim 353, therein said metal foam body comprises a stacked array of discs of metal foam material.

356. The fluorine chemistry source of claim 353, wherein said metal foam body has solid fluorine source material in particulate form in porosity throughout said metal foam body.

357. The fluorine chemistry source of claim 353, further comprising flow circuitry coupled to said reagent supply vessel for supplying vapor from said solid fluorine source material to a chamber for cleaning thereof, wherein the reagent supply vessel and flow circuitry are arranged so that said vapor dispensed from the reagent supply vessel into the flow circuitry does not condense in the flow circuitry.

358. The fluorine chemistry source according to claim 353, comprising a solid fluorine source material dispersed in porosity of said metal foam body and adapted to deliver vapor from said solid fluorine source material near or below room temperature (25°

C.).

359. The fluorine chemistry source of claim 353, arranged to maintain said reagent supply vessel at temperature in a range of from 20°

to 30°

C., said reagent supply vessel being of cylindrical shape, and said metal foam body being of cylindrical shape and disposed in said interior volume of the reagent supply vessel as a press-fit insert therein, with a solid fluorine chemistry source material disposed in porosity of said metal foam body.

360. The fluorine chemistry source of claim 353, wherein the solid fluorine source material comprises xenon difluoride, and said vessel is adapted to generate xenon difluoride vapor solely by conduction of ambient heat through said vessel to said metal foam body, for said sublimation of said solid fluorine source material.

361. The fluorine chemistry source of claim 353, wherein said vessel comprises structural parts including a first part formed of steel and a second part formed of aluminum.

362. A method of cleaning an ion implanter, said method comprising generating XeF₂ vapor from solid XeF₂ contained in porosity of a metal foam, and contacting said XeF₂ vapor with said ion implanter for cleaning thereof.

363. The method of claim 362, wherein said metal foam comprises an aluminum foam contained in an aluminum vessel disposed in a gas box of the ion implanter, and said XeF₂ vapor is selectively dispensed from said aluminum vessel for said contacting.

364. The method of claim 362, wherein said XeF₂ vapor is generated at temperature in a range of from 20°

to 30°

C.

365. A method of cleaning a chamber having solid deposited material thereon that is removably reactive with xenon difluoride vapor, to remove such material, said method comprising contacting said solid deposited material with xenon difluoride vapor for sufficient time to effect removal of at least part of said solid deposited material from said chamber.