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Use Of Heat-Activated Adhesive For Manufacture And A Device So Manufactured

  • US 20080191174A1
  • Filed: 06/22/2006
  • Published: 08/14/2008
  • Est. Priority Date: 07/08/2005
  • Status: Abandoned Application
First Claim
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1. Use of a heat-activated adhesive for manufacturing of intelligent devices comprising an electronic module and printed conductive electronics, like conductive traces, antennas on a flexible substrate, characterized by that the adhesive is an anisotropic electrically conductive thermoplastic adhesive and is applied to the substrate as a thin film which can be used for adhering components to the substrate, for electrical connections and for providing mechanical stability to the printed conductive traces.

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