Use Of Heat-Activated Adhesive For Manufacture And A Device So Manufactured
First Claim
1. Use of a heat-activated adhesive for manufacturing of intelligent devices comprising an electronic module and printed conductive electronics, like conductive traces, antennas on a flexible substrate, characterized by that the adhesive is an anisotropic electrically conductive thermoplastic adhesive and is applied to the substrate as a thin film which can be used for adhering components to the substrate, for electrical connections and for providing mechanical stability to the printed conductive traces.
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Accused Products
Abstract
The invention is based on use of a heat-activated adhesive for manufacturing of intelligent devices comprising printed conductive electronics on a flexible substrate, where the adhesive is an anisotropic electrically conductive adhesive and is applied to the substrate as a thin film which can be used for electrical connections and for providing mechanical stability to the printed conductive electronics.
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Citations
20 Claims
- 1. Use of a heat-activated adhesive for manufacturing of intelligent devices comprising an electronic module and printed conductive electronics, like conductive traces, antennas on a flexible substrate, characterized by that the adhesive is an anisotropic electrically conductive thermoplastic adhesive and is applied to the substrate as a thin film which can be used for adhering components to the substrate, for electrical connections and for providing mechanical stability to the printed conductive traces.
Specification