Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

• US 20080191220A1
• Filed: 12/18/2007
• Published: 08/14/2008
• Est. Priority Date: 03/29/2004
• Status: Abandoned Application

• Current Assignee: Articulated Technologies, LLC
• Original Assignee: Articulated Technologies, LLC
• Inventors: Daniels, John J., Nelson, Gregory V.
• Application Number:
  US12/002,556
• Publication Number:
  US 20080191220A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/29 of an individual layer connector
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29298 Fillers
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/75822 Rotational mechanism
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8388 Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
• CPC Class Codes: H01L 2224/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2224/95145 Electrostatic alignment, i.e. polarity alignment with Coulomb charges
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/33 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01016 : Sulfur [S]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01025 : Manganese [Mn]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10336 : Aluminium gallium arsenide [AlGaAs]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 31/022425 : for solar cells
• CPC Class Codes: H01L 31/048 : Encapsulation of modules
• CPC Class Codes: H01L 31/1876 : Particular processes or apparatus for batch treatment of the devices
• CPC Class Codes: H01L 31/188 : Apparatus specially adapted for automatic interconnection of solar cells in a module
• CPC Class Codes: H01L 33/52 : Encapsulations
• CPC Class Codes: Y02E 10/50 : Photovoltaic [PV] energy
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A light active sheet, comprising a first substrate flexible sheet having an electrically conductive surface, a second transparent substrate flexible sheet having a transparent conductive layer disposed thereon, an electrically insulative adhesive flexible sheet and light active semiconductor elements fixed to the electrically insulative adhesive sheet. The light active semiconductor elements each have an n-side and a p-side. The electrically insulative adhesive sheet having the light active semiconductor elements fixed thereon is inserted between the electrically conductive surface and the transparent conductive layer to form a lamination which is activated so that the electrically insulative adhesive electrically insulates and binds the second substrate sheet to the first substrate sheet. One of the n-side and p-side are in electrical communication with the transparent conductive layer and the other of the n-side or the p-side is in electrical communication with the electrically conductive surface.

Claims

1. ) A light active sheet, comprising:

a first substrate flexible sheet having an electrically conductive surface;

a second transparent substrate flexible sheet having a transparent conductive layer disposed thereon;

an electrically insulative adhesive flexible sheet;

light active semiconductor elements fixed to the electrically insulative adhesive sheet, said light active semiconductor elements each having an n-side and a p-side, the electrically insulative adhesive sheet having the light active semiconductor elements fixed thereon being inserted between the electrically conductive surface and the transparent conductive layer to form a lamination and activated so that the electrically insulative adhesive electrically insulates and binds the second substrate sheet to the first substrate sheet so that one of said n-side or said p-side of the light active semiconductor elements is in electrical communication with the transparent conductive layer of the second substrate sheet and so that the other of said n-side or said p-side of each said light active semiconductor element is in electrical communication with the electrically conductive surface of the first substrate sheet to form a light active device.

2. ) A light active sheet according to claim 1;

wherein the first substrate, the electrically insulative adhesive and the second substrate are provided as respective rolls of material; and

the step of inserting comprising bringing the first substrate, the electrically insulative adhesive and the second substrate together in a continuous roll fabrication process.

3. ) A light active sheet according to claim 1;

wherein the electrically insulative adhesive comprises a hotmelt material activatable by applying heat and pressure to the lamination to soften the hotmelt material.

4. ) A light active sheet according to claim 1;

wherein the adhesive is activatable by at least one of solvent action, evaporation, catalytic reaction and radiation curing.

5. ) A light active sheet according to claim 1;

wherein the light active semiconductor elements are light emitting diode die.

6. ) A light active sheet according to claim 1;

wherein the light active semiconductor elements are light-to-energy devices.

7. ) A light active sheet according to claim 1;

wherein a first portion of the light active semiconductor elements emit a first wavelength of radiation and a second portion of the light active semiconductor elements emit a second wavelength of radiation.

8. ) A light active sheet according to claim 1;

wherein the electrically insulative adhesive comprises a hotmelt sheet; and

the light active semiconductor elements are embedded into the hotmelt sheet before forming the lamination.

9. ) A light active sheet according to claim 1;

wherein the light active semiconductor elements are formed into a predetermined pattern.

10. ) A light active sheet according to claim 9;

wherein the light active semiconductor elements are formed into the predetermined pattern by electrostatically attracting a plurality of said light active semiconductor elements on a transfer member and transferring the predetermined pattern onto the insulative adhesive.

11. ) A method of making a light active sheet according to claim 9;

wherein the light active semiconductor elements are formed into the predetermined pattern by magnetically attracting a plurality of said light active semiconductor elements on a transfer member and transferring the predetermined pattern onto the insulative adhesive.

12. ) A light active sheet according to claim 1;

wherein the transparent conductive layer comprises a transparent conductive material formed as conductive light transmissive connecting lands, each said land for connecting with a respective light active semiconductor.

13. ) A light active sheet according to claim 12;

further comprising a relatively higher conducting line pattern formed on at least one of the second substrate and the first substrate for providing a relatively lower path of resistance from a power supply source to each said light active semiconductor element.

14. ) A light active sheet according to claim 1;

wherein the electrically conductive surface and the electrically conductive pattern comprise a respective x and y wiring grid for selectively addressing individual said light active semiconductor elements for forming a display.

15. ) A light active sheet according to claim 1;

further comprising a phosphor provided in the lamination, said phosphor being optically stimulated by a radiation emission of a first wavelength from the light active semiconductor element to emit light of a second wavelength.

16. ) A light active sheet according to claim 1;

further comprising at least one additional semiconductor element, each of said additional semiconductor elements having a first conductor, a second conductor and a middle conductor region disposed therebetween; and

wherein said electrically insulative adhesive includes at least one electrically conductive portion for making an electrical connection with said middle conductor region.

17. ) A light active sheet according to claim 16;

wherein at least one of said at least one additional semiconductor elements is an npn type semiconductor element.