LIGHT EMITTING DIODE STRUCTURE WITH HIGH HEAT DISSIPATION

• US 20080191235A1
• Filed: 06/02/2007
• Published: 08/14/2008
• Est. Priority Date: 02/13/2007
• Status: Abandoned Application

• Current Assignee: Harvatek Corporation
• Original Assignee: Harvatek Corporation
• Inventors: Chuang, Jonnie, Huang, Miko, WANG, Bily
• Application Number:
  US11/757,356
• Publication Number:
  US 20080191235A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A light emitting diode structure with a high heat dissipating effect includes a lead frame, a chip, two lead wires, an internal casing and an external casing. The lead frame has a first electrode and a second electrode, and the first electrode forms a cavity for installing the visible or invisible light chip in the cavity, and the chip is electrically coupled to two lead wires, and an end of the two lead wires is electrically and respectively coupled to the first and second electrodes, and the chip has an internal casing, and the two lead wires of the lead frame and the surface of the internal casing are wrapped by an external casing having a base and a lens.

Claims

1. A light emitting diode structure with high heat dissipation, comprising:

a lead frame, having a first electrode and a second electrode disposed thereon;

a carrying portion disposed on the first electrode,

a cavity disposed on a front side of the carrying portion;

a first lead coupled to an end of the carrying portion;

a heat dissipating protrusion disposed on a back side of the carrying portion and protruding from the back side of the carrying portion essentially in a normal direction thereof;

a solder portion and a second formed on the second electrode;

a chip, mounted onto the cavity;

two lead wires, for electrically coupling the chip to the first and second electrodes; and

an external casing, having a base for wrapping the carrying portion, the chip, the lead wire and the solder portion, and the base carrying a lens;

thereby, back sides of the first and second electrodes are exposed after the external casing wraps the carrying portion, the chip, the lead wire and the solder portion.

wherein the carrying portion is configured to transfer heat out of the external casing to an ambient environment via the heat dissipating protrusion.

2. The structure of claim 1, wherein the lead frame is made of metal.

5. The structure of claim 1, wherein the cavity and the chip are fixed by an adhesive, and the adhesive is an epoxy resin.

6. The structure of claim 1, further comprising an internal casing for wrapping the chip, the internal casing being covered by the external casing.

7. The structure of claim 1, wherein the heat dissipating protrusion is in a circular shape.

8. The structure of claim 1, wherein the carrying portion and the solder portion respectively have a plurality of through holes formed thereon.

9. The structure of claim 1, wherein the external casing is made of an epoxy compound.

10. The structure of claim 1, wherein the chip is a light emitting diode chip.

11. The structure of claim 1, further comprising a fluorescent layer included between the chip and the internal casing.

3. (canceled)

4. (canceled)