Cooling Device for a Light-Emitting Semiconductor Device and a Method of Manufacturing Such a Cooling Device

• US 20080191236A1
• Filed: 04/19/2006
• Published: 08/14/2008
• Est. Priority Date: 04/27/2005
• Status: Active Grant

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: De Graaf, Jan, Verschuuren, Marcus Antonius, Kop, Theo Arnold, Nicole, Celine Catherine Sarah, Marra, Johan, Wolf, Ronald Martin, Van Sprang, Hans
• Granted Patent: US 7,855,449 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/043 forming loops, e.g. capillary pumped loops
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28F 21/04 of ceramic; of concrete; of natural stone
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A cooling device for cooling a light-emitting semiconductor device, such as a LED device (20), comprises a ceramic plate (15) having coolant-conveying channels (12) incorporated therein. The ceramic plate (15) is adapted for forming an integral part of the optical system of the light-emitting semiconductor device (20) and to cool a light-emitting portion (26) of the light-emitting semiconductor device (20). A method of forming a cooling device comprises the steps of forming a charge of ceramic particles, embossing the charge with a stamp to form coolant-conveying channels in the charge, hardening the charge, and providing a cover on top of the channels to seal them.

Claims

1. A cooling device for cooling a light-emitting semiconductor device, the cooling device comprising a ceramic plate having coolant conveying channels incorporated therein, the ceramic plate being adapted for forming an integral part of the optical system of the light-emitting semiconductor device.

2. A cooling device according to claim 1, wherein the channels are heat pipe channels that contain, sealed in the channels, a liquid.

3. A cooling device according to claim 1, wherein the ceramic plate comprises an at least partly translucent ceramic material.

4. A cooling device according to claim 3, wherein the ceramic plate comprises a luminescent material.

5. A cooling device according to claim 3, wherein the ceramic plate is adapted to be at least partly located at the front side of a light-emitting portion of the light-emitting semiconductor device and in optical and thermal contact with that portion.

6. A cooling device according to claim 5, wherein the ceramic plate is adapted to be glued to said portion.

7. A cooling device according to claim 1, wherein the ceramic plate is adapted to form part of a slug located at the back side of a light-emitting portion of the light-emitting semiconductor device.

8. A cooling device according to claim 7, wherein the ceramic plate is adapted to reflect light emitted by said portion of the light-emitting semiconductor device.

12. A light-emitting semiconductor device provided with a cooling device according to claim 1.

9. A method of forming a device for cooling a light-emitting semiconductor device, the method comprising the steps of

forming a charge of ceramic particles,

embossing the charge with a stamp, said stamp comprising a pattern, to form coolant-conveying channels in the charge,

hardening the charge, and

providing a cover on top of the channels to seal them and to form a ceramic plate comprising coolant-conveying channels, the plate being adapted for forming an integrated element of the light-emitting semiconductor device.

10. A method according to claim 9, wherein, subsequent to providing said cover, an amount of liquid is provided in each channel and is sealed in said channel to provide the channel with heat pipe properties.

11. A method according to claim 9, wherein the charge comprises a liquid suspension of ceramic particles, the step of hardening the charge comprising sucking the liquid out of the charge.