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Image sensor package with die receiving opening and method of the same

  • US 20080191333A1
  • Filed: 02/08/2007
  • Published: 08/14/2008
  • Est. Priority Date: 02/08/2007
  • Status: Abandoned Application
First Claim
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1. A structure of image sensor package, comprising:

  • a substrate with a die through hole and contact through holes structure formed there through, wherein terminal pads are formed under said contact through hole structure and contact pads are formed on a upper surface of said substrate;

    a die having a micro lens area disposed within said die through hole;

    a wire bonding formed on said die and said substrate, wherein said wire bonding is coupled to said die and said contact pad;

    a transparent cover disposed on said die within said die through hole by adhesion to create an air gap between said transparent cover; and

    a protective layer covering over said wire bonding and filling into the gap between said die edge and the sidewall of said die through hole of said substrate.

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