Image sensor package with die receiving opening and method of the same

• US 20080191333A1
• Filed: 02/08/2007
• Published: 08/14/2008
• Est. Priority Date: 02/08/2007
• Status: Abandoned Application

• Current Assignee: Advanced Chip Engineering Technology Inc.
• Original Assignee: Advanced Chip Engineering Technology Inc.
• Inventors: Lin, Diann-Fang, Yang, Wen-Kun, Chang, Jui-Hsien, Hsu, Hsien-Wen, Wang, Tung-chuan
• Application Number:
  US11/703,663
• Publication Number:
  US 20080191333A1
• Time in Patent Office: Days
• US Class Current: 257/680
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48235 connecting the wire to a via metallisation of the item
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/16235 : Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18165 : of a wire bonded chip
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. A protective layer is formed to cover the wire bonding. A transparent cover is disposed on the die within the die through hole by adhesion to expose the micro lens area. Conductive bumps are coupled to the terminal pads.

Claims

1. A structure of image sensor package, comprising:

a substrate with a die through hole and contact through holes structure formed there through, wherein terminal pads are formed under said contact through hole structure and contact pads are formed on a upper surface of said substrate;

a die having a micro lens area disposed within said die through hole;

a wire bonding formed on said die and said substrate, wherein said wire bonding is coupled to said die and said contact pad;

a transparent cover disposed on said die within said die through hole by adhesion to create an air gap between said transparent cover; and

a protective layer covering over said wire bonding and filling into the gap between said die edge and the sidewall of said die through hole of said substrate.

2. The structure of claim 1, further comprising conductive bumps coupled to said terminal pads.

3. The structure of claim 1, wherein material said protective layer includes compound, liquid compound, silicone rubber.

4. The structure of claim 1, wherein said protective layer comprises elastic material, photosensitive material or dielectric material.

5. The structure of claim 1, further comprising a barrier layer formed on the sidewall of said die through hole of said substrate.

6. The structure of claim 5, wherein said barrier layer comprises a metal layer.

7. The structure of claim 1, wherein said contact through holes structure includes the semi-spherical sharp in the scribe line area or sidewall area of die through hole of said substrate.

8. The structure of claim 1, wherein the material of said substrate includes epoxy type FR5, FR4.

9. The structure of claim 1, wherein the material of said substrate includes BT.

10. The structure of claim 1, wherein the material of said substrate includes PCB (print circuit board).

11. The structure of claim 1, wherein the material of said substrate includes alloy or metal.

12. The structure of claim 1, wherein the material of said substrate includes glass, silicon, ceramic.

13. The structure of claim 1, further comprising a protection layer formed on said micro lens area to protect the micro lens away the particles contamination.

14. The structure of claim 13, wherein materials of said protection layer includes SiO₂, Al₂O₃ or Fluoro-polymer.

15. The structure of claim 13, wherein said protection layer with water repellent and oil repellent properties.

16. The structure of claim 1, wherein said transparent cover is coated IR filter formed over said micro lens area.

17. A method for forming semiconductor device package, comprising:

providing a substrate with die through holes and contact through holes structure formed there through on a tool, wherein terminal pads are formed under said contact through hole structure and contact pads are formed on a upper surface of said substrate;

attaching adhesive material on image sensor chips back side;

using a pick and place fine alignment system to re-distribute known good dice said image sensor chips on said tool with desired pitch;

forming a wire bonding to couple between said chip and contact pad of said substrate; and

forming a protective layer to cover said wire bonding, and fill into the gap between said die edge and the sidewall of said die through hole of said substrate, and vacuum curing then separating said tool.

18. The method of claim 17, wherein said image sensor chip has a protection layer formed on micro lens area to protect the micro lens away the particles contamination.

19. The method of claim 17, wherein said image sensor chip has a transparent cover adhesive on micro lens, and the adhesive material surrounds the micro lens area to expose said micro lens area.

20. The method of claim 17, further comprising a step of singulating said semiconductor device package into individual units.

21. A structure of image sensor module, comprising:

a flex print circuit board (FPC) with wiring circuit, connection pads and connector;

a solder paste to solder said connection pads of said FPC and the terminal pads of a substrate;

wherein said substrate has die through holes and contact through holes structure formed there through, wherein said terminal pads are formed under said contact through hole structure and contact pads are formed on a upper surface of said substrate;

a die having a micro lens area disposed within said die through hole;

a wire bonding formed on said die and said substrate, wherein said wire bonding is coupled to said die and said contact pad; and

a transparent cover disposed on said die within said die through hole by adhesion to create an air gap between said transparent cover and said micro lens area.

a protective layer covering over said wire bonding and filling into the gap between said die edge and the sidewall of said die through hole of said substrate; and

a lens holder with lens fixed on said FPC and disposed above said transparent cover to allow the light passing through said micro lens area.

22. The structure of claim 21, further comprising passive components soldering join on said FPC.