METHOD OF FABRICATING REFLECTIVE SPATIAL LIGHT MODULATOR HAVING HIGH CONTRAST RATIO
First Claim
1. A reflecting structure comprising:
- a CMOS substrate comprising an electrode;
a first post and a second post, each of the first post and the second post being coupled to the CMOS substrate, wherein the first post and the second post overlie the CMOS substrate and define a first distance separating the first post and the second post;
a moveable stack overlying each of the first post and the second post, the moveable stack comprising;
a silicon layer defining;
a moveable hinge portion extending between the first post and the second post; and
a mirror support portion;
a plurality of supporting structures coupled to the mirror support portion; and
a reflecting surface supported by and overlying the plurality of supporting structures, wherein the reflecting surface is free from contact with the moveable hinge portion and is characterized by a distance measured between diagonal corners of the reflecting surface greater than the first distance.
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Abstract
The contrast offered by a spatial light modulator device may be enhanced by positioning nonreflective elements such as supporting posts and moveable hinges, behind the reflecting surface of the pixel. In accordance with one embodiment, the reflecting surface is suspended over and underlying hinge-containing layer by integral ribs of the reflecting material defined by gaps in a sacrificial layer. In accordance with an alternative embodiment, the reflecting surface is separated from the underlying hinge by a gap formed in an intervening layer, such as oxide. In either embodiment, walls separating adjacent pixel regions may be recessed beneath the reflecting surface to further reduce unwanted scattering of incident light and thereby enhance contrast.
14 Citations
21 Claims
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1. A reflecting structure comprising:
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a CMOS substrate comprising an electrode; a first post and a second post, each of the first post and the second post being coupled to the CMOS substrate, wherein the first post and the second post overlie the CMOS substrate and define a first distance separating the first post and the second post; a moveable stack overlying each of the first post and the second post, the moveable stack comprising; a silicon layer defining; a moveable hinge portion extending between the first post and the second post; and a mirror support portion; a plurality of supporting structures coupled to the mirror support portion; and a reflecting surface supported by and overlying the plurality of supporting structures, wherein the reflecting surface is free from contact with the moveable hinge portion and is characterized by a distance measured between diagonal corners of the reflecting surface greater than the first distance. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A reflecting structure comprising:
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a CMOS substrate comprising an electrode; a wall having a lower surface coupled to the CMOS substrate and an upper surface disposed opposite the lower surface and separated from the lower surface by a wall height, wherein the wall overlies the CMOS substrate; a first post characterized by a post height and a second post characterized by the post height, each of the first post and the second post being coupled to the CMOS substrate, wherein the first post and the second post overlie the CMOS substrate and the post height is greater than the wall height; a moveable stack overlying each of the first post and the second post, the moveable stack comprising; a silicon layer defining; a moveable hinge portion extending between the first post and the second post; and a mirror support portion; a plurality of supporting structures coupled to the mirror support portion; and a reflecting surface supported by and overlying the plurality of supporting structures, wherein the reflecting surface is free from contact with the moveable hinge portion. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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Specification