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HIGH THERMAL CONDUCTIVITY PACKAGING FOR SOLID STATE LIGHT EMITTING APPARATUS AND ASSOCIATED ASSEMBLING METHODS

  • US 20080192493A1
  • Filed: 02/12/2007
  • Published: 08/14/2008
  • Est. Priority Date: 02/12/2007
  • Status: Active Grant
First Claim
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1. A light emitting apparatus comprising:

  • a hardcoat anodized aluminum substrate; and

    a plurality of solid state light emitting elements mounted on the hardcoat anodized aluminum substrate.

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  • 3 Assignments
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