Method of processing a workpiece using a mid-chamber gas distribution plate, tuned plasma flow control grid and electrode

• US 20080193673A1
• Filed: 11/28/2007
• Published: 08/14/2008
• Est. Priority Date: 12/05/2006
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Todorow, Valentin N., Paterson, Alexander M., Katz, Dan, Hatcher, Brian K., Panagopoulos, Theodoros, Holland, John P., Hammond, Edward P.
• Application Number:
  US11/998,458
• Publication Number:
  US 20080193673A1
• Time in Patent Office: Days
• US Class Current: 427/569
• CPC Class Codes: H01J 37/32091 the radio frequency energy being capacitively coupled to the plasma
• CPC Class Codes: H01J 37/321 the radio frequency energy being inductively coupled to the plasma
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01J 37/32422 Arrangement for selecting ions or species in the plasma
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow

Abstract

A method of processing a workpiece in a plasma reactor chamber is disclosed. The method includes providing an in-situ gas distribution plate between the workpiece and a ceiling of the chamber that divides the chamber into upper and lower chamber regions. The method further includes providing in the in-situ plate an array of feed-through openings with different opening sizes to present a non-uniform distribution of gas flow resistance for gas flow from the upper chamber region to the lower chamber region. A first process gas is introduced into the upper chamber region and a plasma is generated a plasma in the upper chamber region. A second process gas is introduced in the lower chamber region through gas injection orifices of the in-situ gas distribution plate.

Claims

1. A method of processing a workpiece in a plasma reactor chamber, comprising:

providing an in-situ gas distribution plate between the workpiece and a ceiling of the chamber that divides the chamber into upper and lower chamber regions;

providing in the in-situ plate an array of feed-through openings with different opening sizes to present a non-uniform distribution of gas flow resistance for gas flow from said upper chamber region to said lower chamber region;

introducing a first process gas into the upper chamber region and generating a plasma in said upper chamber region;

introducing a second process gas in the lower chamber region through gas injection orifices of the in-situ gas distribution plate.

2. The method of claim 1 further comprising coupling a voltage source to a conductive electrode of the in-situ gas distribution plate.

3. The method of claim 1 further comprising:

evacuating said lower chamber region with a vacuum pump;

maintaining a pressure difference across said in-situ gas distribution plate in accordance with gas flow resistance of said in-situ plate so as to maintain said lower chamber region at lower chamber pressure than said upper chamber region.

4. The method of claim 1 further comprising attaining greater dissociation of species in said upper chamber region and a lesser dissociation of species in said lower chamber region.

5. The method of claim 1 wherein the step of generating a plasma in said upper chamber region comprises applying RF plasma source power to a source power applicator adjacent the ceiling of said chamber.

6. The method of claim 5 wherein the step of generating a plasma in said upper chamber comprises inductively coupling RF power to ions in said upper chamber region.

7. The method of claim 6 further comprising applying RF bias power to the workpiece.

8. The method of claim 1 wherein the step of introducing a second process gas in the lower chamber region through gas injection orifices of the in-situ gas distribution plate comprises introducing one gas composition at a first flow rate through an inner gas injection zone of said orifices while introducing another gas composition at a second flow rate through an outer gas injection zone of said orifices.

9. The method of claim 8 further comprising adjusting said first and second flow rates to improve uniformity of process rate across a surface of said workpiece.

10. The method of claim 2 wherein said voltage source comprises at least one of a ground potential, a D.C. voltage source, an RF voltage source, a VHF voltage source.

11. The method of claim 1 wherein the step of generating a plasma in said upper chamber region produces a center high ion density distribution in said upper chamber region, and wherein said method further comprises providing said distribution of gas flow rate through said in-situ plate as a center high distribution to provide an ion distribution in said lower chamber region that is more uniform than the center high ion distribution of said upper chamber region.

12. The method of claim 1 further comprising dissociating said first process gas in said upper chamber region while minimizing dissociation of said second process gas in said lower chamber region.

13. The method of claim 1 further comprising producing highly dissociated species in said upper chamber region from said first process gas while producing minimally dissociated or undissociated species in said lower chamber region from said second process gas.

14. The method of claim 1 further comprising optimizing the generation of plasma ions in said upper chamber region by adjusting the volume of said upper chamber region.

15. The method of claim 14 wherein the step of adjusting said volume comprises adjusting an axial position of the workpiece.

16. The method of claim 1 wherein the step of generating a plasma in said upper chamber region comprises inductively coupling RF plasma source power into said upper chamber region, said method further comprising capacitively coupling VHF plasma source power into said lower chamber region.

17. A method of processing a workpiece in a plasma reactor chamber, comprising:

providing an in-situ gas distribution plate between the workpiece and a ceiling of the chamber that divides the chamber into upper and lower chamber regions;

providing in the in-situ plate an array of feed-through openings for gas flow from said upper chamber region to said lower chamber region;

introducing a first process gas into the upper chamber region and generating a plasma in said upper chamber region while introducing a second process gas in the lower chamber region through gas injection orifices of the in-situ gas distribution plate; and

coupling a voltage source to a conductive electrode of the in-situ gas distribution plate.

18. The method of claim 17 further comprising attaining greater dissociation of species in said upper chamber region and a lesser dissociation of species in said lower chamber region.

19. The method of claim 17 further comprising applying RF bias power to the workpiece.

20. The method of claim 17 wherein the step of introducing a second process gas in the lower chamber region through gas injection orifices of the in-situ gas distribution plate comprises introducing one gas composition at a first flow rate through an inner gas injection zone of said orifices while introducing another gas composition at a second flow rate through an outer gas injection zone of said orifices.

21. A method comprising:

providing an in-situ gas distribution plate between the workpiece and a ceiling of the chamber that divides the chamber into upper and lower chamber regions;

providing in the in-situ plate an array of feed-through openings with different opening sizes to present a non-uniform distribution of gas flow resistance for gas flow from said upper chamber region to said lower chamber region; and

controlling a gas distribution flow through said in-situ gas distribution plate.

22. The method of claim 21 further comprising:

introducing a first process gas into the upper chamber region and generating a plasma in said upper chamber region; and

introducing a second process gas in the lower chamber region through gas injection orifices of the in-situ gas distribution plate.