Methods of forming packaged semiconductor light emitting devices having multiple optical elements by compression molding
First Claim
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1. A method of packaging a semiconductor light emitting device, comprising:
- providing a substrate having the semiconductor light emitting device on a front face thereof;
forming a first optical element from a first material on the front face proximate the semiconductor light emitting device; and
forming a second optical element from a second material, different from the first material, over the semiconductor light emitting device and the first optical element, wherein forming the first optical element and/or forming the second optical element comprise compression molding the respective optical element.
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Abstract
Methods of packaging semiconductor light emitting devices include providing a substrate having the semiconductor light emitting device on a front face thereof. A first optical element is formed from a first material on the front face proximate the semiconductor light emitting device. A second optical element is formed from a second material, different from the first material, over the semiconductor light emitting device and the first optical element. The first optical element and/or the second optical element are formed by compression molding the respective optical element.
72 Citations
32 Claims
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1. A method of packaging a semiconductor light emitting device, comprising:
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providing a substrate having the semiconductor light emitting device on a front face thereof; forming a first optical element from a first material on the front face proximate the semiconductor light emitting device; and forming a second optical element from a second material, different from the first material, over the semiconductor light emitting device and the first optical element, wherein forming the first optical element and/or forming the second optical element comprise compression molding the respective optical element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A packaged semiconductor light emitting device, comprising:
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a substrate; a semiconductor light emitting device mounted on a front face of the substrate; a first optical element on the front face of the substrate proximate the semiconductor light emitting device; and a second optical element on the front face of the substrate over the semiconductor light emitting device and the first optical element, wherein the first optical element and/or the second optical element comprise compression molded optical elements. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification