PROBES FOR ULTRASOUND IMAGING SYSTEMS

• US 20080194960A1
• Filed: 02/08/2007
• Published: 08/14/2008
• Est. Priority Date: 02/08/2007
• Status: Abandoned Application

• Current Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Original Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Inventors: Randall, Kevin S.
• Application Number:
  US11/672,566
• Publication Number:
  US 20080194960A1
• Time in Patent Office: Days
• US Class Current: 600/459
• CPC Class Codes: A61B 2560/0214 of power generation or supply
• CPC Class Codes: A61B 8/00 Diagnosis using ultrasonic, sonic or infrasonic waves imaging of objects using sonar G01S15/00
• CPC Class Codes: A61B 8/4405 Device being mounted on a trolley
• CPC Class Codes: A61B 8/4411 Device being modular
• CPC Class Codes: A61B 8/4455 Features of the external shape of the probe, e.g. ergonomic aspects
• CPC Class Codes: A61B 8/4472 Wireless probes
• CPC Class Codes: A61B 8/565 involving data transmission via a network
• CPC Class Codes: G01S 7/52023 Details of receivers
• CPC Class Codes: G01S 7/5208 with integration of processing functions inside probe or scanhead
• CPC Class Codes: G10K 11/004 Mounting transducers, e.g. provided with mechanical moving or orienting device mountings specially adapted to a particular sound-producing device, see the preceding groups G10K1/00 - G10K9/00, e.g. G10K1/26, G10K1/28, G10K9/22; arrangements of sonic watch equipment on submarines B63G8/39; buoys B63B22/00

Abstract

Embodiments of probes for ultrasound imaging systems can be disassembled so that components located within housings of the probes can be re-used.

Claims

1. A probe for an ultrasound imaging system, comprising a transducer array that emits acoustical energy and receives return reflections of the acoustical energy, a circuit substrate, a transmitter mounted on the circuit substrate and communicatively coupled to the transducer array, and a housing comprising a backshell and a nosepiece removably attached to the backshell, wherein the housing has an interior volume and the transducer array, the circuit substrate, and the transmitter are positioned in the interior volume.

2. The probe of claim 1, wherein the nosepiece and the backshell have interlocking joints, and the nosepiece is removably attached to the backshell by the interlocking joints.

3. The probe of claim 1, wherein a sealing material is disposed within joints between the nosepiece and the backshell.

4. The probe of claim 3, wherein the sealing material is substantially insoluble in water.

5. The probe of claim 4, wherein the sealing material is a non-adhesive material.

6. The probe of claim 3, wherein the sealing material is grease or wax.

7. The probe of claim 3, wherein the sealing material is a gasket.

8. The probe of claim 1, wherein the nosepiece is removably attached to the backshell by an adhesive having a bond strength that is lower than a yield strength of the material or materials from which the nosepiece is formed.

9. The probe of claim 1, wherein the nosepiece is removably attached to the backshell by fasteners and/or latches.

10. The probe of claim 1, wherein the backshell comprises an upper clamshell, and a lower clamshell attached to the upper clamshell.

11. The probe of claim 10, wherein the upper clamshell is attached to the lower clamshell by a first adhesive having a first bond strength;

and the nosepiece is attached to the upper and lower clamshells by a second adhesive having a second bond strength lower than the first bond strength.

12. The probe of claim 10, wherein the upper and lower clamshells have interlocking joints, and the upper clamshell is attached to the lower clamshell by the interlocking joints.

13. The probe of claim 10, wherein the upper clamshell is attached to the lower clamshell by a first set of joints on the upper and lower clamshells, the upper and lower clamshells are attached to the nosepiece by a second set of joints on the upper and lower clamshells and the nosepiece, and an overlap of contacting surfaces of the first set of joints is less than an overlap of contacting surfaces of the second set of joints.

14. The probe of claim 1, wherein the housing is sealed so that the interior volume is isolated from the environment around the housing.

15. The probe of claim 1, wherein the transmitter is a transceiver.

16. The probe of claim 1, further comprising a battery pack including a rechargeable battery, wherein the housing further comprises a battery panel attached to or unitarily formed with the backshell, and the battery pack is removably mounted on the battery panel.

17. The probe of claim 16, wherein the battery panel is attached to the backshell by a first adhesive having a first bond strength, and the nosepiece is attached to the backshell by a second adhesive having a second bond strength lower than the first bond strength.

18. The probe of claim 1, further comprising a circuit board assembly communicatively coupled to the transducer array and the transmitter, wherein the circuit board assembly comprises the circuit substrate, and the transmitter is mounted on the circuit substrate.

19. The probe of claim 18, wherein the circuit board assembly further comprises an acoustic transmit timing device communicatively coupled to the transducer array and the transmitter, wherein the acoustic transmit timing device controls the timing of the emitted acoustical energy.

20. The probe of claim 19, wherein the circuit board assembly further comprises a time-varying gain circuit communicatively coupled to the transducer array for compensating for attenuation of the acoustical energy emitted by the transducer array, and an analog to digital converter communicatively coupled to the time-varying gain circuit.

21. The probe of claim 18, wherein the circuit board assembly further comprises a receive amplifier communicatively coupled to the transducer array, wherein the receive amplifier amplifies the output of the transducer array.

22. The probe of claim 1, wherein the transducer array is potted into the nosepiece.

23. The probe of claim 18, wherein the transducer array is electrically connected to the circuit substrate by a non-permanent connection.

24. The probe of claim 23, wherein the non-permanent connection is an electrical connector.

25. The probe of claim 23, wherein the non-permanent connection is a solder connection.

26. The probe of claim 1, wherein the interior volume is filled with an inert gas.

27. The probe of claim 1, further comprising a non-removable battery.

28. The probe of claim 27, further comprising an electrical contact electrically connected to the battery for mating with an electrical contact of a charging station.

29. The probe of claim 28, further comprising a diode, a MOSFET, or a semiconductor switching device connected in series with the battery and the contact so that electrical current can flow in only one direction between the battery and the electrical contact.

30. The probe of claim 28, further comprising a relay electrically connected to the electrical contact and the battery and mounted in the housing, wherein actuation of the relay places the battery in electrical contact with the electrical contact.

31. The probe of claim 30, wherein the relay is a magnetically-actuated relay, and a magnet mounted on the charging station actuates the relay when the probe is placed in the charging station.

32. The probe of claim 28, further comprising a switch electrically connected to the electrical contact and the battery and mounted in the housing, wherein contact between the switch and the charging station actuates the switch when the probe is placed in the charging station, and actuation of the switch places the battery in electrical contact with the second electrical contact.

33. The probe of claim 28, further comprising an electrically-insulative barrier surrounding the electrical contact.

34. The probe of claim 33, wherein the electrically-insulative barrier is a gasket.

35. The probe of claim 33, wherein the probe is drawn into a first position in relation to the housing as the probe and the charging station are partially mated;

the housing and the charging station exert a compressive force on the barrier when the probe is in the first position; and

the probe backs away from the charging station as the probe moves from the first position to a fully mated position in relation to the charging station so that the compressive force decreases as the probe moves from the first position to the fully mated position.

36. The probe of claim 2, wherein the interlocking joints have a saw-tooth configuration.

37. A probe for an ultrasound imaging system, comprising:

a transducer array positioned within the housing, the transducer array emitting acoustical energy and receiving return reflections of the acoustical energy;

a transmitter communicatively coupled to the transducer array; and

a housing having a nosepiece and a backshell, wherein the transducer array is potted into the nosepiece, and the nosepiece is attached to the backshell by at least one of;

interlocking joints formed on the nosepiece and the backshell;

an adhesive having a bond strength that is lower than a yield strength of the material or materials from which the nosepiece is formed;

fasteners; and

latches.

38. The probe of claim 37, wherein a sealing material is disposed between joints of the nosepiece and the backshell.

39. The probe of claim 38, wherein the sealing material is substantially insoluble in water.

40. The probe of claim 39, wherein the sealing material is a non-adhesive material.

41. The probe of claim 38, wherein the sealing material is grease or wax.

42. The probe of claim 38, wherein the sealing material is a gasket.

43. The probe of claim 37, wherein the backshell comprises an upper clamshell, and a lower clamshell attached to the upper clamshell.

44. The probe of claim 43, wherein the nosepiece is attached to the upper and lower clamshells by the adhesive;

the adhesive has a first bond strength; and

the upper clamshell is attached to the lower clamshell by a second adhesive having a second bond strength that is greater than the first bond strength.

45. The probe of claim 43, wherein the upper and lower clamshells have interlocking joints, and the upper clamshell is attached to the lower clamshell by the interlocking joints.

46. The probe of claim 43, wherein the upper clamshell is attached to the lower clamshell by a first set of joints on the upper and lower clamshells, the upper and lower clamshells are attached to the nosepiece by a second set of joints on the upper and lower clamshells and the nosepiece, and an overlap of contacting surfaces of the first set of joints is less than an overlap of contacting surfaces of the second set of joints.

47. The probe of claim 37, further comprising a battery pack including a rechargeable battery, wherein the housing further comprises a battery panel attached to or unitarily formed with the backshell, and the battery pack is removably mounted on the battery panel.

48. The probe of claim 37, further comprising a circuit board assembly communicatively coupled to the transducer array and the transmitter, wherein the circuit board assembly comprises a circuit substrate, and the transmitter is mounted on the circuit substrate.

49. The probe of claim 48, wherein the circuit board assembly further comprises an acoustic transmit timing device communicatively coupled to the transducer array, wherein the acoustic transmit timing device controls the timing of pulses of the acoustical energy.

50. A method for disassembling a probe for an ultrasound imaging system, the probe comprising a transducer array, a circuit board assembly communicatively coupled to the transducer array, and a housing comprising (i) a nosepiece that forms a forward end of the housing and (ii) a backshell attached to the nosepiece, the method comprising:

cutting the backshell;

removing a portion of the backshell aft of the cut; and

cutting or breaking a remaining portion of the backshell.

51. The method of claim 50, further comprising detaching pieces of the backshell formed by cutting or breaking a remaining portion of the backshell from the nosepiece.

52. The method of claim 50, wherein cutting the backshell comprises cutting the backshell along an entire circumference of the backshell at a location aft of a joint between the nosepiece and the backshell.

53. The method of claim 50, further comprising removing a circuit board assembly from the probe after removing the portion of the backshell aft of the cut.

54. The method of claim 51, wherein detaching pieces of the backshell formed by cutting or breaking a remaining portion of the backshell from the nosepiece comprises prying or peeling the pieces from a joint of the nosepiece.

55. The method of claim 50, further comprising reusing the transducer array and/or the circuit substrate.

56. The method of claim 55, wherein reusing the transducer array and/or the circuit substrate comprises installing the transducer array and/or the circuit substrate in another probe.

57. The method of claim 50, further comprising testing the transducer array and/or the circuit substrate.

58. The method of claim 50, further comprising discarding the transducer array and/or the circuit substrate.

59. A method for recovering components from an ultrasound imaging probe, the probe comprising a transducer array, a circuit board assembly communicatively coupled to the transducer array, a transmitter mounted on the circuit board and communicatively coupled to the transducer array, and a housing, the method comprising:

determining that the probe is at least partially compromised;

separating a portion of the housing in a way that renders the portion non-reusable;

extracting a component from the probe; and

re-using the extracted component.

60. The method of claim 59, wherein the extracted component comprises the transducer array.

61. The method of claim 60, wherein the extracted component further comprises a portion of the housing.

62. The method of claim 61, wherein the extracted component is tested before it is re-used.

63. The method of claim 62, wherein the extracted component is cleaned before it is re-used.

64. The method of claim 59, wherein the extracted component comprises the circuit board assembly.

65. The method of claim 64, wherein the circuit board assembly is tested before it is re-used.

66. The method of claim 59, wherein a component of the probe is discarded.

67. The method of claim 66, wherein the discarded component comprises a portion of the housing.