PROBES FOR ULTRASOUND IMAGING SYSTEMS
First Claim
Patent Images
1. A probe for an ultrasound imaging system, comprising:
- a housing;
a transducer array positioned within the housing, the transducer array emitting acoustical energy and receiving return reflections of the acoustical energy;
a circuit substrate positioned within the housing; and
a compliant mount connecting the circuit substrate to the housing and substantially buffering the circuit substrate from mechanical shock.
2 Assignments
0 Petitions
Accused Products
Abstract
Embodiments of probes for ultrasound imaging systems can be configured to withstand being dropped or otherwise subjected to mechanical shock.
97 Citations
57 Claims
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1. A probe for an ultrasound imaging system, comprising:
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a housing; a transducer array positioned within the housing, the transducer array emitting acoustical energy and receiving return reflections of the acoustical energy; a circuit substrate positioned within the housing; and a compliant mount connecting the circuit substrate to the housing and substantially buffering the circuit substrate from mechanical shock. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A probe for an ultrasound imaging system, comprising:
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a housing; a transducer array positioned within the housing, the transducer array emitting acoustical energy and receiving return reflections of the acoustical energy; and at least one of a compliant bumper mounted on the housing and compliant cladding attached to an exterior surface of the housing. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49)
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50. A probe for an ultrasound imaging system, comprising:
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a housing; a transducer array positioned within the housing, the transducer array emitting acoustical energy and receiving return reflections of the acoustical energy; a circuit substrate communicatively coupled to the transducer array, wherein at least a portion of the circuit substrate is potted and/or is covered by electronic circuit conformal coating; and a transmitter mounted on the circuit substrate and communicatively coupled to the transducer array for transmitting information relating to the return reflections. - View Dependent Claims (51, 52, 53, 54, 55, 56, 57)
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Specification